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Conference Proceedings

1. Room-Temperature Wafer Bonding Using Ar Beam Surface Activation

Takagi, H. ; Maeda, R. ; Hosoda, N. ; Chung, T.R. ; Suga, T.

Pub. info.:	Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia. pp.265-274, 1999. Pennington, N.J.. Electrochemical Society
Title of ser.:	Electrochemical Society Proceedings Series
Ser. no.:	99-35

Conference Proceedings

2. HIGHLY TEXTURED SUPERCONDUCTING Bi2Sr2CaCu2OY CRYSTALS PREPARED BY UNIDIRECTIONAL SOLIDIFICATION PROCESSING

Shiohara, Y. ; Oyama, T. ; Nakagawa, M. ; Suga, T. ; Ishige, K. ; Izumi, T. ; Nagaya, S. ; Miyajima, M. ; Hirabayashi, I. ; Tanaka, S.

Pub. info.:	High-temperature superconductors : fundamental properties and novel materials processing : symposium held November 27-December 2, 1989, Boston, Massachusetts, U.S.A.. pp.305-308, 1990. Pittsburgh, Pa.. Materials Research Society
Title of ser.:	Materials Research Society symposium proceedings
Ser. no.:	169

Conference Proceedings

3. CHARACTERIZATION OF THE ADHERENCE OF METALS TO CERAMICS BY A FRACTURE MECHANICS CONCEPT

Suga, T. ; Elssner, G.

Pub. info.:	Electronic packaging materials science : symposium held November 27-29, 1984, Boston, Massachusetts, U.S.A.. pp.203-210, 1985. Pittsburgh, Pa.. Materials Research Society
Title of ser.:	Materials Research Society symposium proceedings
Ser. no.:	40

Conference Proceedings

4. Silicon Wafer Bonding at Room Temperature by Ar Beam Surface Activation in Vacuum

Takagi, H. ; Maeda, R. ; Chung, T.R. ; Suga, T.

Pub. info.:	Proceedings of the Fourth International Symposium on Semiconductor Wafer Bonding : science, technology, and applications. pp.393-400, 1997. Pennington, NJ. Electrochemical Society
Title of ser.:	Electrochemical Society Proceedings Series
Ser. no.:	97-36

Conference Proceedings

5. Piezoelectric Force Sensing Pb(Zr,Ti)O3 Microcantilever Array for Multiprobe Scanning Force Microscopy

Itoh, T. ; Lee, C. ; Chu, J. ; Suga, T.

Pub. info.:	Materials for mechanical and optical microsystems : symposium held December 4-5, 1996, Boston, Massachusetts,U.S.A.. pp.59-, 1997. Pittsburgh, Pa.. MRS - Materials Research Society
Title of ser.:	Materials Research Society symposium proceedings
Ser. no.:	444

Conference Proceedings

6. Smart Piezoelectric PZT Microcantilevers with Inherent Sensing and Actuating Abilities for AFM and LFM

Lee, C. ; Itoh, T. ; Chu, J. ; Ohashi, T. ; Maeda, R. ; Schroth, A. ; Suga, T.

Pub. info.:	Materials for smart systems II : sympsoium held December 2-5, 1996, Boston, Massachusetts, U.S.A.. pp.35-, 1997. Pittsburgh, PA. MRS - Materials Research Society
Title of ser.:	Materials Research Society symposium proceedings
Ser. no.:	459

Conference Proceedings

7. Structure and properties of fullerene nanowhiskers prepared by the liquid-liquid interfacial precipitation method (Invited Paper)

Miyazawa, K. ; Fujino, M. ; Minato, J. ; Yoshii, T. ; Kizuka, T. ; Suga, T.

Pub. info.:	Smart materials III : 13-15 December 2004, Sydney, Australia. pp.224-234, 2004. Bellingham, Wash., USA. SPIE - The International Society of Optical Engineering
Title of ser.:	Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:	5648

Conference Proceedings

8. Activation Process and Bonding Mechanism of Si/LiNbO3 and LiNbO3/LiNbO3 at Room Temperature

Howlader, M.R. ; Suga, T. ; Kim, M.J.

Pub. info.:	Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia. pp.319-325, 2005. Pennington, NJ. Electrochemical Society
Title of ser.:	Electrochemical Society Proceedings Series
Ser. no.:	2005-02

Conference Proceedings

9. Wafer Level and Chip Size Direct Wafer Bonding at Room Temperature

Howlader, M. M. M. ; Suga, T.

Pub. info.:	State-of-the-art program on compound semiconductors XLI and nitride and wide bandgap semiconductors for sensors, photonics, and electronics V : proceedings of the international symposia. pp.150-160, 2004. Pennington, N.J.. Electrochemical Society
Title of ser.:	Electrochemical Society Proceedings Series
Ser. no.:	2004-06

10.

Conference Proceedings

10. Wafer-Scale Surface Activated Bonding of Cu-Cu, Cu-Si, and Cu-SiO2 at Low Temperature

Kim, T.H. ; Howlader, M.M.R. ; Itoh, T. ; Suga, T.

Pub. info.:	Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia. pp.239-247, 2003. Pennington, NJ. Electrochemical Society
Title of ser.:	Electrochemical Society Proceedings Series
Ser. no.:	2003-19

11.

Conference Proceedings

11. Development of an UHV Surface Activated Bonding Machine for MEMS Packaging

Howlader, M.M.R. ; Okada, H. ; Itoh, T. ; Suga, T.

Pub. info.:	Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia. pp.309-320, 2003. Pennington, NJ. Electrochemical Society
Title of ser.:	Electrochemical Society Proceedings Series
Ser. no.:	2003-19

12.

Conference Proceedings

12. Bonding Strength and Electrical Characteristics of Si/Si, Si/InP and Si/GaAs Interfaces Bonded by Surface Activated Bonding at Room Temperature: Influences of Sputtering Time and Energy

Howlader, M. ; Watanabe, T. ; Suga, T.

Pub. info.:	Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia. pp.41-47, 2001. Pennington, NJ. Electrochemical Society
Title of ser.:	Electrochemical Society Proceedings Series
Ser. no.:	2001-27

13.

Conference Proceedings

13. Low-temperature bonding of a LiNbO3 waveguide chip to a Si substrate in ambient air for hybrid-integrated optical devices [6376-02]

Takigawa, R. ; Higurashi, E. ; Suga, T. ; Shinada, S. ; Kawanishi, T.

Pub. info.:	Optomechatronic Micro/Nano Devices and Components II. pp.637603-637603, 2006. Bellingham, Wash.. SPIE - The International Society of Optical Engineering
Title of ser.:	Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:	6376

14.

Conference Proceedings

14. Mechanical properties of lead-free solder alloys evaluated by miniature size specimen [5852-48]

Kariya, Y. ; Asai, T. ; Suga, T.

Pub. info.:	Third International Conference on Experimental Mechanics and Third Conference of the Asian Committee on Experimental Mechanics. pp.297-301, 2005. Bellingham, Wash.. SPIE - The International Society of Optical Engineering
Title of ser.:	Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:	5852

15.

Conference Proceedings

15. Resonant-typed microscanners fabricated by hybrid PZT deposition process on SOI wafers

Tsaur, J.-J. ; Wang, Z.J. ; Zhang, L. ; Ichiki, M. ; Maeda, R. ; Suga, T.

Pub. info.:	Nano- and Microtechnology: Materials, Processes, Packaging, and Systems. pp.215-224, 2002. Bellingham, Wash.. SPIE-The International Society for Optical Engineering
Title of ser.:	Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:	4936

16.

Conference Proceedings

16. Microsensors and actuator arrays based on Pb(Zr,Ti) O3 thin film for AFM data storage

Chu, J. ; Lu, J. ; Wu, Y. ; Huang, W. ; Maeda, R. ; Itoh, T. ; Suga, T.

Pub. info.:	Micromachining and Microfabrication Process Technology and Devices. pp.379-383, 2001. Bellingham, Wash.. SPIE-The International Society for Optical Engineering
Title of ser.:	Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:	4601

17.

Conference Proceedings

17. investigation of splitting SPP modes propagating at metal-dielectric interface

Suga, T. ; Niimi, T. ; Kobayashi, l. ; Katagiri, Y. ; Nakano, Y. ; Mitsuoka, Y.

Pub. info.:	Optomechatronic Micro/Nano Components, Devices, and Systems. pp.173-184, 2004. SPIE - The International Society of Optical Engineering
Title of ser.:	Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:	5604

18.

Conference Proceedings

18. Hybrid integration technologies for optical micro-systems (Invited Paper)

Higurashi, E. ; Itoh, T. ; Suga, T. ; Sawada, R.

Pub. info.:	Optomechatronic Micro/Nano Components, Devices, and Systems. pp.67-73, 2004. SPIE - The International Society of Optical Engineering
Title of ser.:	Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:	5604

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