Search records | 東京工業大学附属図書館文献データベース

You can search for articles included in proceedings of international conferences and technical papers which Tokyo Tech Library holds.
Tokyo Tech members can obtain tables of contents of 17,000 foreign journals by SwetScan. Tokyo Tech Library does not cover all of them.
List of Searchable Databases

Clear Form

Search for other sites by same keyword(s).

CiNii Books

NDL Search

WebcatPlus

amazon

カーリル

WorldCat

Filter

Title:

Author:

ISBN / ISSN / Paper No:

Source Title:

Publisher:

Publication Year:

～

Clear Form

Type:

Conference Proceedings

Technical Paper

Academic Journal

Select: Check all | Remove all

Sort order

10 | 50 | 100 / Per Page

18 results

Conference Proceedings

1. Room-Temperature Wafer Bonding Using Ar Beam Surface Activation

Takagi, H. ; Maeda, R. ; Hosoda, N. ; Chung, T.R. ; Suga, T.

Pub. info.:	Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia. pp.265-274, 1999. Pennington, N.J.. Electrochemical Society
Title of ser.:	Electrochemical Society Proceedings Series
Ser. no.:	99-35

Conference Proceedings

2. HIGHLY TEXTURED SUPERCONDUCTING Bi2Sr2CaCu2OY CRYSTALS PREPARED BY UNIDIRECTIONAL SOLIDIFICATION PROCESSING

Shiohara, Y. ; Oyama, T. ; Nakagawa, M. ; Suga, T. ; Ishige, K. ; Izumi, T. ; Nagaya, S. ; Miyajima, M. ; Hirabayashi, I. ; Tanaka, S.

Pub. info.:	High-temperature superconductors : fundamental properties and novel materials processing : symposium held November 27-December 2, 1989, Boston, Massachusetts, U.S.A.. pp.305-308, 1990. Pittsburgh, Pa.. Materials Research Society
Title of ser.:	Materials Research Society symposium proceedings
Ser. no.:	169

Conference Proceedings

3. CHARACTERIZATION OF THE ADHERENCE OF METALS TO CERAMICS BY A FRACTURE MECHANICS CONCEPT

Suga, T. ; Elssner, G.

Pub. info.:	Electronic packaging materials science : symposium held November 27-29, 1984, Boston, Massachusetts, U.S.A.. pp.203-210, 1985. Pittsburgh, Pa.. Materials Research Society
Title of ser.:	Materials Research Society symposium proceedings
Ser. no.:	40

Conference Proceedings

4. Silicon Wafer Bonding at Room Temperature by Ar Beam Surface Activation in Vacuum

Takagi, H. ; Maeda, R. ; Chung, T.R. ; Suga, T.

Pub. info.:	Proceedings of the Fourth International Symposium on Semiconductor Wafer Bonding : science, technology, and applications. pp.393-400, 1997. Pennington, NJ. Electrochemical Society
Title of ser.:	Electrochemical Society Proceedings Series
Ser. no.:	97-36

Conference Proceedings

5. Piezoelectric Force Sensing Pb(Zr,Ti)O3 Microcantilever Array for Multiprobe Scanning Force Microscopy

Itoh, T. ; Lee, C. ; Chu, J. ; Suga, T.

Pub. info.:	Materials for mechanical and optical microsystems : symposium held December 4-5, 1996, Boston, Massachusetts,U.S.A.. pp.59-, 1997. Pittsburgh, Pa.. MRS - Materials Research Society
Title of ser.:	Materials Research Society symposium proceedings
Ser. no.:	444

Conference Proceedings

6. Smart Piezoelectric PZT Microcantilevers with Inherent Sensing and Actuating Abilities for AFM and LFM

Lee, C. ; Itoh, T. ; Chu, J. ; Ohashi, T. ; Maeda, R. ; Schroth, A. ; Suga, T.

Pub. info.:	Materials for smart systems II : sympsoium held December 2-5, 1996, Boston, Massachusetts, U.S.A.. pp.35-, 1997. Pittsburgh, PA. MRS - Materials Research Society
Title of ser.:	Materials Research Society symposium proceedings
Ser. no.:	459

Conference Proceedings

7. Structure and properties of fullerene nanowhiskers prepared by the liquid-liquid interfacial precipitation method (Invited Paper)

Miyazawa, K. ; Fujino, M. ; Minato, J. ; Yoshii, T. ; Kizuka, T. ; Suga, T.

Pub. info.:	Smart materials III : 13-15 December 2004, Sydney, Australia. pp.224-234, 2004. Bellingham, Wash., USA. SPIE - The International Society of Optical Engineering
Title of ser.:	Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:	5648

Conference Proceedings

8. Activation Process and Bonding Mechanism of Si/LiNbO3 and LiNbO3/LiNbO3 at Room Temperature

Howlader, M.R. ; Suga, T. ; Kim, M.J.

Pub. info.:	Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia. pp.319-325, 2005. Pennington, NJ. Electrochemical Society
Title of ser.:	Electrochemical Society Proceedings Series
Ser. no.:	2005-02

Conference Proceedings

9. Wafer Level and Chip Size Direct Wafer Bonding at Room Temperature

Howlader, M. M. M. ; Suga, T.

Pub. info.:	State-of-the-art program on compound semiconductors XLI and nitride and wide bandgap semiconductors for sensors, photonics, and electronics V : proceedings of the international symposia. pp.150-160, 2004. Pennington, N.J.. Electrochemical Society
Title of ser.:	Electrochemical Society Proceedings Series
Ser. no.:	2004-06

10.

Conference Proceedings

10. Wafer-Scale Surface Activated Bonding of Cu-Cu, Cu-Si, and Cu-SiO2 at Low Temperature

Kim, T.H. ; Howlader, M.M.R. ; Itoh, T. ; Suga, T.

Pub. info.:	Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia. pp.239-247, 2003. Pennington, NJ. Electrochemical Society
Title of ser.:	Electrochemical Society Proceedings Series
Ser. no.:	2003-19

18 results

Select: Check all | Remove all

Sort order

10 | 50 | 100 / Per Page

Filtering by: