1.

Conference Proceedings
Conference Proceedings
1. Room-Temperature Wafer Bonding Using Ar Beam Surface Activation
Takagi, H. ; Maeda, R. ; Hosoda, N. ; Chung, T.R. ; Suga, T.
Pub. info.: Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia.  pp.265-274,  1999.  Pennington, N.J..  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 99-35
2.

Conference Proceedings
Conference Proceedings
2. Silicon Wafer Bonding at Room Temperature by Ar Beam Surface Activation in Vacuum
Takagi, H. ; Maeda, R. ; Chung, T.R. ; Suga, T.
Pub. info.: Proceedings of the Fourth International Symposium on Semiconductor Wafer Bonding : science, technology, and applications.  pp.393-400,  1997.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 97-36