The Integration of Shallow Trench Isolation (STI) for High Density DRAM with 0.18 μm Technology and Beyond
- Author(s):
Pan, P. McQueen, M. Robinson, K. Sharan, S. Batra, S. Lane, R. Somerville, L. Tran, L.C. - Publication title:
- ULSI process integration : proceedings of the first international symposium
- Title of ser.:
- Electrochemical Society Proceedings Series
- Ser. no.:
- 99-18
- Pub. Year:
- 1999
- Page(from):
- 213
- Page(to):
- 222
- Pub. info.:
- Pennington, NJ: Electrochemical Society
- ISSN:
- 01616374
- ISBN:
- 9781566772419 [1566772419]
- Language:
- English
- Call no.:
- E23400/99-18
- Type:
- Conference Proceedings
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