1.

Conference Proceedings
Conference Proceedings
1. Plasma Charging Damage Performance Assessment with Scaled-up Process from 200 mm to 300 mm Dielectric Etch Chambers
Ma, S. ; Bjorkman, C. ; Mays, B. ; Kropwenicki, T. ; Feng, T. ; Li, Q. ; Dadu, U. ; Chang, M. ; Shan, H.
Pub. info.: Thin film materials, processes, and reliability : proceedings of the international symposium.  pp.14-22,  2001.  Pennington, N.J..  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2001-24
2.

Conference Proceedings
Conference Proceedings
2. A Novel Approach to Reduce Via Corner Faceting in the Via-First, No Middle Stop Layer Dual Damascene Trench Etch
Kim, Y-S. ; Doan, K.L. ; Bjorkman, C. ; Paterson, A. ; Sui, Z. ; Shan, H.
Pub. info.: Plasma processing XIV : proceedings of the international symposium.  pp.277-289,  2002.  Pennington, N.J..  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2002-17