Integration of a W-plug in an Al-based metallization scheme for O.25-ヲフm IC technology
- Author(s):
- Sengupta,S.S. ( VLSI Technology,Inc. )
- Bothra,S. ( VLSI Technology,Inc. )
- Publication title:
- Multilevel Interconnect Technology II
- Title of ser.:
- Proceedings of SPIE - the International Society for Optical Engineering
- Ser. no.:
- 3508
- Pub. Year:
- 1998
- Page(from):
- 110
- Page(to):
- 121
- Pub. info.:
- Bellingham, Wash.: SPIE-The International Society for Optical Engineering
- ISSN:
- 0277786X
- ISBN:
- 9780819429674 [0819429678]
- Language:
- English
- Call no.:
- P63600/3508
- Type:
- Conference Proceedings
Similar Items:
1
Conference Proceedings
Optimizing Sputtered TiN Arc Film Properties for Lithography of Sub-0.25 ヲフm Interconnect
MRS - Materials Research Society |
7
Conference Proceedings
Evaluation of the Electromigration Performance of New Aluminum Via Plug-Fill Techniques for 0.25ヲフm and 0.18ヲフm Technologies
MRS - Materials Research Society |
2
Conference Proceedings
Integration of Multi-Level Copper Metallization into a High-Performance Sub-0.25 ヲフm Technology
MRS - Materials Research Society |
8
Conference Proceedings
Statistical design of experimental analysis of TiN films deposited by ion metal plasma PVD for sub-0.25-ヲフm IC process applications
SPIE-The International Society for Optical Engineering |
SPIE - The International Society for Optical Engineering |
SPIE-The International Society for Optical Engineering |
MRS - Materials Research Society |
SPIE - The International Society for Optical Engineering |
5
Conference Proceedings
Analysis of Copper and Low-K Dielectric Interconnect System for 0.18-ヲフm Technology
MRS - Materials Research Society |
SPIE-The International Society for Optical Engineering |
SPIE-The International Society for Optical Engineering |
SPIE-The International Society for Optical Engineering |