Extension of high-density interconnect multichip module technology for MEMS packaging
- Author(s):
- Butler,J.T. ( Air Force Institute of Technology )
- Bright,V.M. ( Air Force Institute of Technology )
- Saia,R.J. ( GE Corporate Research and Development Ctr. )
- Comtois,J.H ( Air Force Research Lab. )
- Publication title:
- Micromachined Devices and Components III
- Title of ser.:
- Proceedings of SPIE - the International Society for Optical Engineering
- Ser. no.:
- 3224
- Pub. Year:
- 1997
- Page(from):
- 169
- Page(to):
- 177
- Pub. info.:
- Bellingham, Wash.: SPIE-The International Society for Optical Engineering
- ISSN:
- 0277786X
- ISBN:
- 9780819426567 [0819426563]
- Language:
- English
- Call no.:
- P63600/3224
- Type:
- Conference Proceedings
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