1.

Conference Proceedings
Conference Proceedings
1. Effects of Abrasive Morphology and Surfactant in Nano-Ceria Slurry for Shallow Trench Isolation Chemical Mechanical Poliahing
Kang, H.-G. ; Katoh, T. ; Lee, W.-M. ; Paik, U. ; Park, J.-G.
Pub. info.: Chemical Mechanical Planarization : proceedings of the International Symposium.  pp.215-222,  2003.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2003-21
2.

Conference Proceedings
Conference Proceedings
2. Effect of Slurry Characteristics on Nanotopography Impact in Chemical Mechanical Polishing
Katoh, T. ; Kim, S.-J. ; Paik, U. ; Park, J.-G.
Pub. info.: Chemical Mechanical Planarization : proceedings of the International Symposium.  pp.190-198,  2003.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2003-21
3.

Conference Proceedings
Conference Proceedings
3. Nanotopography Effect of Improved Single-Side-Polished Wafer on Oxide CMP
Katoh, T. ; Park, J.-G. ; Park, J.-H. ; Paik, U.-G.
Pub. info.: Chemical Mechanical Planarization : proceedings of the International Symposium.  pp.193-201,  2002.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2002-1
4.

Conference Proceedings
Conference Proceedings
4. Spectral Analysis Method for Nanotopography Impact on Pad and Removal Depth Dependency in Oxide CMP
Park, J.-G. ; Katoh, T. ; Yoo, H-C. ; Paik, U.-G.
Pub. info.: Chemical Mechanical Planarization : proceedings of the International Symposium.  pp.202-209,  2002.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2002-1