Numerical Simulation of Multilayer Perforated Insulation Material Using in Space

Numerical Simulation of Multilayer Perforated Insulation Material Using in Space

Author(s):

P. Li ( Department of Aeronautical and Astronautical Engineering, Shanghai Jiao Tong University, Shanghai, China (prc) )
H. Cheng

Publication title:

AIAA meeting papers on disc

Title of ser.:

AIAA Paper : AIAA/ASME Joint Thermophysics and Heat Transfer Conference

Ser. no.:

2006

Pub. Year:

2006

No.:

2006-3778

Paper no.:

AIAA Paper 2006-3778

Pub. info.:

Reston, Va: American Institute of Aeronautics and Astronautics

ISSN:

10877215

Language:

English

Call no.:

A07400/200613 [CD-ROM Disc 13]

Type:

Technical Paper

Details

TDL ID:	ZA00047239
Series ID:	PA00000169
Conf. info. (Name):	AIAA/ASME Joint Thermophysics and Heat Transfer Conference
Conf. info. (Number):	9th
Conf. info. (Venue):	San Francisco, California
Conf. info. (Date):	2006.06.05-2006.06.08

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