Thermal Management of Power Electronics Modules Packaged by a Stacked-Plate Technique

Thermal Management of Power Electronics Modules Packaged by a Stacked-Plate Technique

Author(s):

Publication title:

Microelectronics : 1-4 November 1998, San Diego Convention Center, San Diego, California

Title of ser.:

Proceedings of SPIE - the International Society for Optical Engineering

Ser. no.:

3582

Pub. Year:

1998

Page(from):

850

Page(to):

855

Pub. info.:

Bellingham, Wash. — Reston, VA: SPIE - The International Society for Optical Engineering — IMAPS

ISSN:

0277786X

ISBN:

9780930815523 [0930815521]

Language:

English

Call no.:

P63600/3582

Type:

Conference Proceedings

Details

TDL ID:	ZA00019455
Series ID:	PA00000029
Conf. info. (Name):	International symposium on microelectronics
Conf. info. (Number):	1998
Conf. info. (Venue):	San Diego, CA, USA
Conf. info. (Date):	1998.11.01-1998.11.04

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