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Conference Proceedings
Conference Proceedings
1. The Smart-Cut Process: Status and Developments
Aspar, B. ; Lagahe, C. ; Moriceau, H. ; Jalaguier, E. ; Mas, A. ; Rayssac, O. ; Biasse, Soubie; B. ; Bruel, M. ; Auberton-Hevre, A.J. ; Barge, T. ; Letertre, F. ; Maleville, C.
Pub. info.: Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia.  pp.48-59,  1999.  Pennington, N.J..  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 99-35
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Conference Proceedings
Conference Proceedings
2. Influence of the annealing duration on the interface roughness and electrical properties of low-dose SIMOX wafers
Munteanu, D. ; Guilhalmenc, C. ; Cristoloveanu, S. ; Moriceau, H. ; Cartier, A.M. ; Aspar, B.
Pub. info.: Proceedings of the Eighth International Symposium on Silicon-on-Insulator Technology and Devices.  pp.131-136,  1997.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 97-23
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Conference Proceedings
Conference Proceedings
3. Unibond SOI wafers achieved by Smart-Cut process
Bruel, M. ; Aspar, B. ; Maleville, C. ; Moriceau, H. ; Auberton-Herve, A.J. ; Barge, T.
Pub. info.: Proceedings of the Eighth International Symposium on Silicon-on-Insulator Technology and Devices.  pp.3-14,  1997.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 97-23
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Conference Proceedings
Conference Proceedings
4. Unibond SOI Wafers Achieved by Smart-Cut Process
Bruel, M. ; Aspar, B. ; Maleville, C. ; Moriceau, H. ; Auberton-Herve, A.J. ; Barge, T.
Pub. info.: Proceedings of the Fourth International Symposium on Semiconductor Wafer Bonding : science, technology, and applications.  pp.13-24,  1997.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 97-36
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Conference Proceedings
Conference Proceedings
5. Detailed Characterization of Wafer Bonding Mechanisms
Maleville, C. ; Rayssac, O. ; Moriceau, H. ; Blasse, B. ; Baroux, L. ; Aspar, B. ; Bruel, M.
Pub. info.: Proceedings of the Fourth International Symposium on Semiconductor Wafer Bonding : science, technology, and applications.  pp.46-55,  1997.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 97-36
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Conference Proceedings
Conference Proceedings
6. Strained Silicon on Insulator Wafers Made by the Smart CutTM Technology
Ghyselen, B. ; Bogumilowicz, Y. ; Aulnette, C. ; Abbadie, A. ; Osternaud, B. ; Besson, P. ; Daval, N. ; Andrieu, F. ; Cayrefourq, I. ; Moriceau, H. ; Ernst, T. ; Tiberj, A. ; Rayssac, O. ; Blondeau, B. ; Mazure, C. ; Lagahe-Blanchard, C. ; Pocas, S. ; Cartier, A.-M. ; Hartmann, J.-M. ; Leduc, P. ; Nardo, C.Di ; Lugand, J.-F. ; Fournel, F. ; Semeria, M.-N. ; Kernevez, N. ; Campidelli, Y. ; Kermarrec, O. ; Morand, Y. ; Rivoire, M. ; Bensahel, D. ; Paillard, V. ; Vincent, L. ; Claverie, A. ; Boucaud, P.
Pub. info.: High-mobility group-IV materials and devices : symposium held April 13-15, 2004, San Francisco, California, U.S.A..  pp.83-88,  2004.  Warrendale, Pa..  Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 809
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Conference Proceedings
Conference Proceedings
7. The Bonding Energy Control: An Original Way to Debondable Substrates
Moriceau, H. ; Rayssac, O. ; Aspar, B. ; Ghyselen, B.
Pub. info.: Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia.  pp.49-56,  2003.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2003-19
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Conference Proceedings
Conference Proceedings
8. IN-SITU PREPARATION OF Y-Ba-Cu-O THIN FILMS USING MASS-SPECTROMETER RATE CONTROL AND ATOMIC OXYGEN
Ohlsen, H. ; Ottosson, M. ; Hudner, J. ; Ostling, M. ; Stolt, L. ; Nordblad, P. ; Villegier, J.-C. ; Moriceau, H. ; Weiss, F. ; Thomas, O.
Pub. info.: Layered superconductors : fabrication, properties, and applications : symposium held April 27-May 1, 1992, in San Francisco, California, U.S.A..  pp.299-304,  1992.  Pittsburgh, Pa..  Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 275
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Conference Proceedings
Conference Proceedings
9. ALD alumina films as buried dielectric layers for SOI structures
de Beaumont, C. ; Moriceau, H. ; Rayssac, O. ; Bresson, N. ; Cristoloveanu, S. ; Charvet, A.M.
Pub. info.: Silicon-on-insulator technology and devices XII : proceedings of the international symposium.  pp.231-236,  2005.  Pennington, N.J..  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2005-03
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Conference Proceedings
Conference Proceedings
10. New SOI devices transferred onto fused silica by direct wafer bonding
Lagahe-Blanchard, C. ; Aspar, B. ; Paillet, P. ; Ferlet-Cavois, V. ; Fel, N. ; Pavageau, C. ; du Port de Poncharra, J. ; Moriceau, H.
Pub. info.: Silicon-on-insulator technology and devices XII : proceedings of the international symposium.  pp.237-242,  2005.  Pennington, N.J..  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2005-03
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Conference Proceedings
Conference Proceedings
11. Single-Crystal Semiconductor Layer Delamination and Transfer Through Hydrogen Implantation
Bruel, M. ; Aspar, B. ; Moriceau, H. ; Jalaguier, E. ; Lagahe, C.
Pub. info.: Proceedings of the Third International Symposium on Defects in Silicon.  pp.203-214,  1999.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 99-1
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Conference Proceedings
Conference Proceedings
12. INVITED: SILICON ON INSULATOR WAFERS USING THE SMART CUT TECHNOLOGY
Auberton-Herve, A.J. ; Barge, T. ; Metral, F. ; Bruel, M. ; Aspar, B. ; Moriceau, H.
Pub. info.: Silicon materials science and technology : proceedings of the Eighth International Symposium on Silicon Materials Science and Technology.  pp.1341-1360,  1998.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 98-1(2)
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Conference Proceedings
Conference Proceedings
13. From SOI to SOIM technology: Application for specific semiconductor processes
Rayssac, O. ; Moriceau, H. ; Olivier, M. ; Stoimenos, I. ; Cartier, A.M. ; Aspar, B.
Pub. info.: Silicon-on-Insulator Technology and Devices X : proceedings of the tenth International Symposium.  pp.39-44,  2001.  Pennington, N.J..  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2001-3
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Conference Proceedings
Conference Proceedings
14. Smart-Cut Technology: An Industrial Application of Ion-Implantation-Induced Cavities
Aspar, B. ; Lagahe, C. ; Moriceau, H. ; Soubie, A. ; Bruel, M. ; Auberton-Herve, A. J. ; Barge, T. ; Maleville, C.
Pub. info.: Defect and impurity engineered semiconductors, II : symposium held April 13-17, 1998, San Francisco, California, U.S.A..  pp.381-,  1998.  Warrendale, Pa.  MRS - Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 510
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Conference Proceedings
Conference Proceedings
15. Smart-Cut(R): The Basic Fabrication Process for Unibond(R) SOI Wafers
Auberton-Herve, A. J. ; Barge, T. ; Metral, F. ; Bruel, M. ; Aspar, B. ; Meleville, C. ; Moriceau, H. ; Poumeyrol, T.
Pub. info.: Amorphous and crystalline insulating thin films--1996 : symposium held December 2-4, 1996, Boston, Massachusetts, U.S.A..  pp.177-,  1997.  Pittsburgh, Pa..  MRS - Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 446
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Conference Proceedings
Conference Proceedings
16. Silicon-on-insulator based quasi 3D photonic crystal structures
Zelsmann, M. ; Picard, E. ; Calvo, V. ; Charvolin, T. ; Hadji, E. ; Moriceau, H. ; Heitzmann, M. ; Nier, M.E. ; Seassal, C. ; Letartre, X.
Pub. info.: Photonic crystal materials and devices III : 24-27 January, 2005, San Jose, California, USA.  pp.23-31,  2005.  Bellingham, Wash..  SPIE - The International Society of Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 5733
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Conference Proceedings
Conference Proceedings
17. X-Ray Characterization of Bonding Interfaces
Rieutord, F. ; Moriceau, H. ; Bataillou, B. ; Morales, C. ; Eymery J.
Pub. info.: Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia.  pp.338-345,  2005.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2005-02
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Conference Proceedings
Conference Proceedings
18. Transfer of Two-Inch GaN Film by the Smart CutTM Technology
Tauzin, A. ; Akatsu, T. ; Rabarot, M. ; Dechamp, J. ; Zussy, M. ; Moriceau, H. ; Michaud, J.F. ; Charvet, A.M. ; Di Cioccio, L. ; Fournel, F. ; Garrione, J. ; Letertre, F. ; Faure, B. ; Kernevez, N.
Pub. info.: Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia.  pp.119-127,  2005.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2005-02
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Conference Proceedings
Conference Proceedings
19. Surface Plasma Activation Before Direct Wafer Bonding: A Short Review and Recent Results
Moriceau, H. ; Rieutord, F. ; Morales, C. ; Sartori, S. ; Charvet, A.M.(Invited)
Pub. info.: Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia.  pp.34-49,  2005.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2005-02
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Conference Proceedings
Conference Proceedings
20. Hydrogen and Helium Implantation to Achieve Layer Transfer
Lagahe-Blanchard, C. ; Sousbie, N. ; Sartori, S. ; Moriceau, H. ; Soubie, A. ; Aspar, B. ; Nguyen, P. ; Blondeau, B.
Pub. info.: Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia.  pp.346-367,  2003.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2003-19
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Conference Proceedings
Conference Proceedings
21. Overview on Some Recent Advances in Wafer Bonding Technologies
Moriceau, H. ; Fournel, F. ; Rayssac, O. ; Cartier, A.M. ; Morales, C. ; Pocas, S. ; Zussy, M. ; Jalaguier, E. ; Biasse, B. ; Bataillou, B. ; Papon, A.M. ; Lagahe, C. ; Aspar, B. ; Maleville, C. ; Leterte, F. ; Ghyselen, B. ; Barge, T.
Pub. info.: Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia.  pp.1-16,  2001.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2001-27
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Conference Proceedings
Conference Proceedings
22. Interest of a Short Plasma Treatment to achieve High Quality Si-SiO2-Si Bonded Structures
Moriceau, H. ; Bataillou, B. ; Morales, C. ; Cartier, A.M. ; Rieutord, F.
Pub. info.: Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia.  pp.110-117,  2003.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2003-19
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Conference Proceedings
Conference Proceedings
23. Effect of silicon nitride and silicon dioxide bonding on the residual stress in layer-transferred SOI
Tiberj, A. ; Caniassel, I. ; Planes, N. ; Stoemenos, Y. ; Moriceau, H. ; Rayssac, O.
Pub. info.: Silicon-on-insulator technology and devices XI : proceedings of the international symposium.  pp.117-122,  2003.  Pennington, N.J..  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2003-5
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Conference Proceedings
Conference Proceedings
24. Smart Cut Technology: the path for advanced SOI substrates
Moriceau, H. ; Lagahe-Blanchard, C. ; Fournel, F. ; Pocas, S. ; Jalaguier, E. ; Perreau, P. ; Deguet, C. ; Ernst, T. ; Beaumont, A. ; Kernevez, N. ; Hartman, J.M. ; Ghyselen, B. ; Aulnette, C. ; Letertre, F. ; Rayssac, O. ; Faure, B. ; Richtarch, C. ; Cayrefourq, I.
Pub. info.: Science and technology of semiconductor-on-insulator structures and devices operating in a harsh environment.  pp.39-52,  2005.  Dordrecht.  Kluwer Academic Publishers
Title of ser.: NATO science series. Series 2, Mathematics, physics and chemistry
Ser. no.: 185
25.

Conference Proceedings
Conference Proceedings
25. Silicon-on-insulator photonic bandgap structures for future microphotonic devices
Hadji, E. ; Cluzel, B. ; Sotta, D. ; Zelsmann, M. ; Picard, E. ; Calvo, V. ; Charvolin, T. ; Heitzmann, M. ; Moriceau, H. ; Seassal, C. ; Letartre, X. ; Ferrand, P.
Pub. info.: Photonic Crystal Materials and Nanostructures.  pp.292-299,  2004.  Bellingham, Wash..  SPIE - The International Society of Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 5450