1.

Conference Proceedings
Conference Proceedings
1. "Si-based multilayered print circuit board for MEMS packaging fabricated by Si deep etching, bonding, and metal powder injection"
Murakoshi,Y. ; Shimizu,T. ; Takagi,H. ; Li,Y. ; Uchino,K. ; Yokoi,T. ; Maeda,R.
Pub. info.: Design, test, integration, and packaging of MEMS/MOEMS 2001 : 25-27 April 2001, Cannes, France.  pp.502-509,  2001.  Bellingham, Washington.  SPIE-The International Society for Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 4408
2.

Conference Proceedings
Conference Proceedings
2. Si/Si Interface Bonded at Room Temperature by Ar Beam Surface Activation
Takagi,H. ; Maeda,R. ; Hosoda,N. ; Suga,T.
Pub. info.: Intergranular and interphase boundaries in materials : iib98 : proceedings of the 9th International Conference on Intergranular and Interphase Boundaries in Materials (iib98), held in Prague, Czech Republic, July, 1998.  pp.341-344,  1999.  Zurich-Uetikon, Switzerland.  Trans Tech Publications
Title of ser.: Materials science forum
Ser. no.: 294-296