1.

Conference Proceedings
Conference Proceedings
1. Post-ECP Annealing For Advanced Copper Interconnect Application
Zhang, Y. ; Koh, L.T. ; Li, C.Y. ; Liu, H. ; You, G.Z ; Wu, J.J. ; Xie, J.
Pub. info.: Semiconductor technology (ISTC 2001) : proceedings of the 1st International Conference on Semiconductor Technology.  pp.78-87,  2001.  Pennington, N.J..  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2001-17
2.

Conference Proceedings
Conference Proceedings
2. New Applications of MetaPULSE in Copper Metallization Process
Liu, H. ; Wang, S.R. ; He, L. ; Zhang, Y. ; Li, W.H. ; Wu, J.J. ; Qian, Y. ; Li, C.Y. ; Koh, L.T. ; Liu, Y.J. ; Xie, J.
Pub. info.: Semiconductor technology (ISTC 2001) : proceedings of the 1st International Conference on Semiconductor Technology.  pp.66-77,  2001.  Pennington, N.J..  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2001-17