1.

Conference Proceedings
Conference Proceedings
1. The Smart-Cut Process: Status and Developments
Aspar, B. ; Lagahe, C. ; Moriceau, H. ; Jalaguier, E. ; Mas, A. ; Rayssac, O. ; Biasse, Soubie; B. ; Bruel, M. ; Auberton-Hevre, A.J. ; Barge, T. ; Letertre, F. ; Maleville, C.
Pub. info.: Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia.  pp.48-59,  1999.  Pennington, N.J..  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 99-35
2.

Conference Proceedings
Conference Proceedings
2. Germanium-on-Insulator (GeOI) Structure Realized by the Smart CutTM Technology
Letertre, F. ; Deguet, C. ; Richtarch, C. ; Faure, B. ; Hartmann, J.M. ; Chieu, F. ; Beaumont, A. ; Dechamp, J. ; Morales, C. ; Allibert, F. ; Perreau, P. ; Pocas, S. ; Personnic, S. ; Lagahe-Blanchard, C. ; Ghyselen, B. ; Vaillant, Y.M.Le ; Jalaguier, E. ; Kernevez, N. ; Mazure, C.
Pub. info.: High-mobility group-IV materials and devices : symposium held April 13-15, 2004, San Francisco, California, U.S.A..  pp.153-160,  2004.  Warrendale, Pa..  Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 809
3.

Conference Proceedings
Conference Proceedings
3. Smart Cut Technology: the path for advanced SOI substrates
Moriceau, H. ; Lagahe-Blanchard, C. ; Fournel, F. ; Pocas, S. ; Jalaguier, E. ; Perreau, P. ; Deguet, C. ; Ernst, T. ; Beaumont, A. ; Kernevez, N. ; Hartman, J.M. ; Ghyselen, B. ; Aulnette, C. ; Letertre, F. ; Rayssac, O. ; Faure, B. ; Richtarch, C. ; Cayrefourq, I.
Pub. info.: Science and technology of semiconductor-on-insulator structures and devices operating in a harsh environment.  pp.39-52,  2005.  Dordrecht.  Kluwer Academic Publishers
Title of ser.: NATO science series. Series 2, Mathematics, physics and chemistry
Ser. no.: 185
4.

Conference Proceedings
Conference Proceedings
4. SiC Power Devices on QUASIC and SiCOI Smart-CutR Substrates: First Demonstrations
Letertre, F. ; Daval, N. ; Templier, F. ; Bano, E. ; Planson, D. ; Di Cioccio, L. ; Jalaguier, E. ; Bluet, J.M. ; Billon, T. ; Madar, R. ; Chante, J.P.
Pub. info.: Silicon carbide and related materials 2002 : ECSCRM2002, proceedings of the 4th European Conference on Silicon Carbide and Related Materials, September 2-5, 2002, Linköping, Sweden.  pp.813-818,  2003.  Zuerich, Switzerland.  Trans Tech Publications
Title of ser.: Materials science forum
Ser. no.: 433-436
5.

Conference Proceedings
Conference Proceedings
5. QuaSiC Smart-Cut Substrates for SiC High Power Devices
Letertre, F. ; Jalaguier, E. ; Di Cioccio, L. ; Templier, F. ; Bluet, J.M. ; Banc, C. ; Matko, I. ; Chenevier, B. ; Bano, E. ; Guillot, G. ; Billon, T. ; Aspar, B. ; Madar, R. ; Ghyselen, B.
Pub. info.: Silicon carbide and related materials 2001 : ICSCRM2001, proceedings of the International Conference on Silicon Carbide and Related Materials 2001, Tsukuba, Japan, October 28-November 2, 2001.  pp.151-154,  2002.  Zuerich, Switzerland.  Trans Tech Publications
Title of ser.: Materials science forum
Ser. no.: 389-393
6.

Conference Proceedings
Conference Proceedings
6. QuaSiC Smart-Cut Substrates for SiC High Power Devices
Letertre, F. ; Jalaguier, E. ; Cioccio, L. D. ; Templier, F. ; Bluet, J.M. ; Banc, C. ; Matko, I. ; Chenevier, B. ; Bano, E. ; Guillot, G. ; Billon, T. ; Aspar, B. ; Madar, R. ; Ghyselen, B.
Pub. info.: Silicon carbide and related materials 2001 : ICSCRM2001, proceedings of the International Conference on Silicon Carbide and Related Materials 2001, Tsukuba, Japan, October 28-November 2, 2001.  pp.151-154,  2002.  Zuerich, Switzerland.  Trans Tech Publications
Title of ser.: Materials science forum
Ser. no.: 389-393