1.

Conference Proceedings
Conference Proceedings
1. Characterization of the Chemical Interactions on Copper Chemical Mechanical Polishing
Lee, S.-M. ; Abiade, J. ; Choi, W. ; Singh, R.
Pub. info.: Chemical Mechanical Planarization : proceedings of the International Symposium.  pp.290-299,  2003.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2003-21
2.

Conference Proceedings
Conference Proceedings
2. Further Investigation of Effects of pH on Silicon Dioxide Chemical Mechanical Polishing (CMP)
Choi, W. ; Lee, S.-M. ; Singh, R.
Pub. info.: Chemical Mechanical Planarization : proceedings of the International Symposium.  pp.207-214,  2003.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2003-21