Blank Cover Image

Electromigration Reliability Of Dual-Damascene Cu/Oxide Interconnets

Author(s):
Ogawa, E.T.
Blaschke, V.A.
Bierwag, A.
Lee, K.
Matsuhashi, H.
Griffiths, D.
Ramamurthi, A.
Justison, P.R.
Havemann, R.H.
Ho, P.S.
5 more
Publication title:
Materials, technology and reliability for advanced interconnects and low-k dielectrics : symposium held April 23-27, 2000, San Francisco, California, U.S.A.
Title of ser.:
Materials Research Society symposium proceedings
Ser. no.:
612
Pub. Year:
2001
Page(from):
D2.3
Pub. info.:
Warrendale, PA: Materials Research Society
ISSN:
02729172
ISBN:
9781558995208 [155899520X]
Language:
English
Call no.:
M23500/612
Type:
Conference Proceedings

Similar Items:

1 Conference Proceedings Electromigration In Submicron Dual-Damascene Cu/Low-K Interconnects

Lee, Ki-Don, Lu, Xia, Ogawa, Ennis T., Matsuhashi, Hideki, Blaschke, Volker A., Augur, Rod, Ho, Paul S.

Materials Research Society
7 Conference Proceedings Stressmigration Studies on Dual Damascene Cu/Oxide and Cu/Low-k Interconnects

Baek, Won-Chong, Ho, Paul S., Lee, Jeong Gun, Hwang, Sung Bo, Choi, Kyeong-Keun, Maeng, Jong Sun

Materials Research Society
2 Conference Proceedings Statistical Analysis of Electromigration Lifetimes and Void Evolution for Cu Interconnects

Hauschildt, M., Gall, M., Thrasher, S., Justison, P., Michaelson, L., Hernandez, R., Kawasaki, H., Ho, P.S.

Materials Research Society
8 Conference Proceedings Electromigration and Stress-Induced Voiding in Fine Al(Cu) Lines

Hu, C.-K., Rodhell, K.P., Sullivan, T.D., Lee, K.Y., Bouldin, D.P.

Electrochemical Society
3 Conference Proceedings Electromigration Study of Cu Dual-Damascene Interconnects With a CVD MSQ Low-k Dielectric

Lu, Xia, Lee, Ki-Don, Yoon, Sean, Matsuhashi, Hideki, Lu, Michael, Zhang, Kai, Ho, Paul S.

Materials Research Society
9 Conference Proceedings Analysis of Electromigration in Dual-Damascene Interconnect Structures

R. Lacerda de Orio, S. Carniello, H. Ceric, S. Selberherr

Electrochemical Society
4 Conference Proceedings Impact of Low-k Dielectrics on Electromigration Reliability for Cu Interconnects

Ho, Paul S., Lee, Ki-Don, Ogawa, Ennis T., Yoon, Sean, Lu, Xia

Materials Research Society
10 Conference Proceedings Unexpected Mode of Plastic Deformation in Cu Damascene Lines Undergoing Electromigration

Budiman, Arief S., Tamura, N., Valek, B.C., Gadre, K., Maiz, J., Spolenak, R., Caldwell, W.A., Nix, W.D., Patel, J.R.

Materials Research Society
5 Conference Proceedings Length Effects On The Reliability Of Dual-Damascene Cu Interconnects

Wei, F., Gan, C.L., Thompson, C.V., Clement, J.J., Hau-Riege, S.P., Pey, K.L., Choi, W.K., Tay, H.L., Yu, B., …

Materials Research Society
11 Conference Proceedings Electromigration and Diffusion in Pure Cu and Cu(Sn) Alloys

Hu, C.-K., Lee, K. L., Gupta, D., Blauner, P.

MRS - Materials Research Society
6 Conference Proceedings Electromigration in on-chip Single/dual Damascene Cu interconnections*

Hu, C.-K, Gignac, L., Liniger, E., Rosenberg, R.

Electrochemical Society
12 Conference Proceedings Electromigration and Diffusion in Pure Cu and Cu(Sn) Alloys

Hu, C-K., Lee, K. L., Gupta, D., Blauner, P.

MRS - Materials Research Society
1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12