1.

Conference Proceedings
Conference Proceedings
1. Wafer Bonding and Thinning for 3D-IC Fabrication
Kwon, Y. ; Jindal, A. ; McMahon, J.J. ; Cale, T.S. ; Gutmann, R.J. ; Lu, J-Q.
Pub. info.: Thin film materials, processes, and reliability, plasma processing for the 100 nm node and copper interconnects with low-k inter-level dielectric films : proceedings of the international symposium.  pp.405-415,  2003.  Pennington, N.J..  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2003-13
2.

Conference Proceedings
Conference Proceedings
2. 3D System-on-a-Chip Using Dielectric Glue Bonding and Cu Damascene Inter-Wafer Interconnects
Lu, J.-Q. ; Jindal, A. ; Kwon, Y. ; McMahon, J.J. ; Lee, K-W. ; Craft, R.P. ; Altemus, B. ; Cheng, D. ; Eisenbraum, E. ; Cale, T.S. ; Gutmann, R.J.
Pub. info.: Thin film materials, processes, and reliability, plasma processing for the 100 nm node and copper interconnects with low-k inter-level dielectric films : proceedings of the international symposium.  pp.381-389,  2003.  Pennington, N.J..  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2003-13
3.

Conference Proceedings
Conference Proceedings
3. Dielectric Glue Wafer Bonding and Bonded Wafer Thinning for Wafer-Level 3D Integration
Lu, J.-Q. ; Kwon, Y. ; Jindal, A. ; McMahon, J.J. ; Cale, T.S. ; Gutmann, R.J.
Pub. info.: Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia.  pp.76-86,  2003.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2003-19
4.

Conference Proceedings
Conference Proceedings
4. Continuous Dynamic Recrystallization of AISI 430 Ferritic Stainless Steel by Hot Torsion Deformation
An, J. Y. ; Han, S. M. ; Kwon, Y. ; Yoo, Y. C.
Pub. info.: PRICM 5 : the Fifth Pacific Rim International Conference on Advanced Materials and Processing, November 2-5, 2004, Beijing, Chin.  pp.145-148,  2005.  Uetikon-Zuerich.  Trans Tech Publications
Title of ser.: Materials science forum
Ser. no.: 475-479(1)
5.

Conference Proceedings
Conference Proceedings
5. Metal-oxide Semiconductor Field-effect Transistors using Single ZnO Nanowire
Heo, Young-Woo ; Kang, B. S. ; Tien, L. C. ; Kwon, Y. ; La-Roche, J. R. ; Gila, B. P. ; Ren, F. ; Pearton, S. J. ; Norton, D. P.
Pub. info.: Progress in compound semiconductor materials -- electronic and optoelectronic applications.  pp.327-332,  2004.  Warrendale, Pa..  Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 829
6.

Conference Proceedings
Conference Proceedings
6. Wafer Thinning for Monolithic 3D Integration
Jindal, A. ; Lu, J. -Q. ; Kwon, Y. ; Rajagopalan, G. ; McMahon, J. J. ; Zeng, A. Y. ; Flesher, H. K. ; Cale, T. S. ; Gutmann, R. J.
Pub. info.: Materials, Technology and Reliability for Advanced Interconnects and Low-k Dielectrics-2003 : symposium held April 21-25, 2003, San Francisco, California, U.S.A..  pp.21-26,  2003.  Warrendale, Pa..  Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 766
7.

Conference Proceedings
Conference Proceedings
7. Dielectric Glue Wafer Bonding for 3D ICs
Kwon, Y. ; Jindal, A. ; McMahon, J. J. ; Lu, J. -Q. ; Gutmann, R. J. ; Cale, T. S.
Pub. info.: Materials, Technology and Reliability for Advanced Interconnects and Low-k Dielectrics-2003 : symposium held April 21-25, 2003, San Francisco, California, U.S.A..  pp.27-32,  2003.  Warrendale, Pa..  Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 766
8.

Conference Proceedings
Conference Proceedings
8. Wafer-Level 3D System-on-a-Chip using Dielectric Glue Wafer Bonding and Cu Damascene Inter-Wafer Interconnects
Lu, J.-Q. ; Jindal, A. ; Kwon, Y. ; McMahon, J.J. ; Lee, K.-W. ; Kraft, R.P. ; Altemus, B. ; Cheng, D. ; Eisenbraun, E. ; Cale, T.S. ; Gutmann, R.J
Pub. info.: Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia.  pp.87-95,  2003.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2003-19
9.

Conference Proceedings
Conference Proceedings
9. Effect of Solution Heat Treatment on Microstructure and Mechanical Properties of Al Alloy FOAM
Lee, S. M. ; Ryu, K. ; Kwon, Y. ; Kim, J. G. ; Cho, W. S. ; Cho, N. H. ; Whang, C. M. ; Yoo, Y. C.
Pub. info.: PRICM 5 : the Fifth Pacific Rim International Conference on Advanced Materials and Processing, November 2-5, 2004, Beijing, Chin.  pp.437-440,  2005.  Uetikon-Zuerich.  Trans Tech Publications
Title of ser.: Materials science forum
Ser. no.: 475-479(1)
10.

Conference Proceedings
Conference Proceedings
10. Wafer Bonding Using Low-k Dielectrics aa Bonding Glue in Three-Dimensional Integration
Kwon, Y. ; Lu, J.-Q. ; Gutmann, R.J. ; Kraft, R.P. ; McDonald, J. ; Cale, T.S.
Pub. info.: Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia.  pp.145-154,  2001.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2001-27
11.

Conference Proceedings
Conference Proceedings
11. Wafer Bonding Using Dielectric Polymer Thin Films in 3D Integration
Kwon, Y. ; Lu, J.-Q. ; Kraft, R.P. ; McDonald, J.F. ; Gutmann, R.J. ; Cale, T.S.
Pub. info.: Polymer interfaces and thin films : symposium held November 26-30, 2001, Boston, Massachusetts, U.S.A..  pp.231-238,  2002.  Warrendale, PA.  Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 710
12.

Conference Proceedings
Conference Proceedings
12. The Effect of Deformation Temperature on the Recrystallization Behavior of AISI 304 Stainless Steel
An, S. J. ; An, J. Y. ; Kim, S. I. ; Kwon, Y. ; Yoo, Y. C.
Pub. info.: PRICM 5 : the Fifth Pacific Rim International Conference on Advanced Materials and Processing, November 2-5, 2004, Beijing, Chin.  pp.161-164,  2005.  Uetikon-Zuerich.  Trans Tech Publications
Title of ser.: Materials science forum
Ser. no.: 475-479(1)
13.

Conference Proceedings
Conference Proceedings
13. Bonding Characterization of Oxidized PDMS Thin Films
McMahon, J.J. ; Kwon, Y. ; Lu, J.-Q. ; Cale, T.S. ; Gutmann, R.J.
Pub. info.: Thin films : stresses and mechanical properties X : symposium held December 1-5, 2003, Boston, Massachusetts, U.S.A..  pp.99-104,  2002.  Warrendale, Pa..  Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 795
14.

Conference Proceedings
Conference Proceedings
14. Fundamental Limits for 3D Wafer-to-Wafer Alignment Accuracy
Wimplinger, M. ; Lu, J.-Q. ; Yu, J. ; Kwon, Y. ; Matthias, T. ; Cale, T.S. ; Gutmann, R.J.
Pub. info.: Materials, technology and reliability for advanced interconnects and low-k dielectrics - 2004 : symposium held April 13-15, 2004, San Francisco, California, U.S.A..  pp.309-314,  2004.  Warrendale.  Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 812
15.

Conference Proceedings
Conference Proceedings
15. Evaluation of Thin Dielectric-Glue Wafer-Bonding for Three Dimensional Integrated Circuit-Applications
Kwon, Y. ; Yu, J. ; McMahon, J.J. ; Lu, J.-Q. ; Cale, T.S. ; Gutmann, R.J.
Pub. info.: Materials, technology and reliability for advanced interconnects and low-k dielectrics - 2004 : symposium held April 13-15, 2004, San Francisco, California, U.S.A..  pp.321-326,  2004.  Warrendale.  Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 812
16.

Conference Proceedings
Conference Proceedings
16. Development of SH-SAW sensors for measurement of the properties of protein solutions (Keynote Address)
Roh, Y. ; Kwon, Y. ; Kim, K. ; Koh, K. ; Kim, J.
Pub. info.: Smart structures and materials 2003 : Smart electronics, MEMS, BioMEMS, and nanotechnology : 3-6 March 2003, San Diego, California, USA.  pp.98-105,  2003.  Bellingham, Wash., USA.  SPIE-The International Society for Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 5055
17.

Technical Paper
Technical Paper
17. A New Current Sensing Scheme for PMSM Drive Inverters in Automotive Applications.
Lee, M. ; Kwon, Y.
Pub. info.: 17th Asia Pacific Automotive Engineering Conference : SAE technical paper.  2013.  Warrendale, Penn..  Society of Automotive Engineers
Title of ser.: Society of Automotive Engineers technical paper series
Ser. no.: 2013
18.

Technical Paper
Technical Paper
18. Multi-Objective Optimization and Robust Design of Brake By Wire System Components.
Kwon, Y. ; Kim, J.
Pub. info.: 31st Annual Brake Colloquium & Exhibition : SAE technical paper.  2013.  Warrendale, Penn..  Society of Automotive Engineers
Title of ser.: Society of Automotive Engineers technical paper series
Ser. no.: 2013
19.

Technical Paper
Technical Paper
19. CONCAWE/GFC Study on Gasoline Volatility and Ethanol Effects on Hot and Cold Weather Driveability of Modern European Vehicles.
McArragher, S. ; Thomson, N. ; Bazzani, R. ; Aarnink, T. ; Kwon, Y.
Pub. info.: 2004 International Fuels and Lubricants Meeting : SAE technical paper.  2004.  Warrendale, Penn..  Society of Automotive Engineers
Title of ser.: Society of Automotive Engineers technical paper series
Ser. no.: 2004
20.

Conference Proceedings
Conference Proceedings
20. An agent-based web services solution to collaborative product design
Huang, C. -C. ; Tseng, T. -L. ; Kwon, Y. ; Chou, Y. Y.
Pub. info.: Intelligent Systems in Design and Manufacturing V.  pp.13-24,  2004.  Bellingham, Wash..  SPIE - The International Society of Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 5605
21.

Conference Proceedings
Conference Proceedings
21. Hybrid data mining and type II fuzzy system approach for surface finish from the prospective of e-manufacturing [5999-21]
Tseng, T.-L. ; Kwon, Y. ; Ho, J. ; Jiang, F.
Pub. info.: Intelligent Systems in Design and Manufacturing VI.  pp.59990I-,  2005.  Bellingham, Wash..  SPIE - The International Society of Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 5999
22.

Conference Proceedings
Conference Proceedings
22. Performance characterization of precison micro robot using a machine vision system over the internet for guaranteed positioning accuracy [5999-08]
Kwon, Y. ; Chiou, R. ; Rauniar, S. ; Sasa, H.
Pub. info.: Intelligent Systems in Design and Manufacturing VI.  pp.599906-599906,  2005.  Bellingham, Wash..  SPIE - The International Society of Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 5999
23.

Conference Proceedings
Conference Proceedings
23. A curvature sensor using white-light scanning interferometry [6292-48]
Kim, B. ; Kim, S. ; Kwon, Y. ; Lee, Y. ; Yang, H. ; Rhee, H.
Pub. info.: Interferometry XIII: Techniques and Analysis.  pp.629219-,  2006.  Bellingham, Wash..  SPIE - The International Society of Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 6292
24.

Conference Proceedings
Conference Proceedings
24. Detection of low amplitude in vivo intrinsic signals from an optical imager of retinalfunction [6138-15]
Barriga, E. S. ; Tso, D. ; Pattichis, M. ; Kwon, Y. ; Kardon, R. ; Abramoff, M. ; Soliz, P.
Pub. info.: Ophthalmic Technologies XVI.  pp.61380F-,  2006.  Bellingham, Wash..  SPIE - The International Society of Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 6138