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21 results

Conference Proceedings

1. Wafer Bonding and Thinning for 3D-IC Fabrication

Kwon, Y. ; Jindal, A. ; McMahon, J.J. ; Cale, T.S. ; Gutmann, R.J. ; Lu, J-Q.

Pub. info.:	Thin film materials, processes, and reliability, plasma processing for the 100 nm node and copper interconnects with low-k inter-level dielectric films : proceedings of the international symposium. pp.405-415, 2003. Pennington, N.J.. Electrochemical Society
Title of ser.:	Electrochemical Society Proceedings Series
Ser. no.:	2003-13

Conference Proceedings

2. 3D System-on-a-Chip Using Dielectric Glue Bonding and Cu Damascene Inter-Wafer Interconnects

Lu, J.-Q. ; Jindal, A. ; Kwon, Y. ; McMahon, J.J. ; Lee, K-W. ; Craft, R.P. ; Altemus, B. ; Cheng, D. ; Eisenbraum, E. ; Cale, T.S. ; Gutmann, R.J.

Pub. info.:	Thin film materials, processes, and reliability, plasma processing for the 100 nm node and copper interconnects with low-k inter-level dielectric films : proceedings of the international symposium. pp.381-389, 2003. Pennington, N.J.. Electrochemical Society
Title of ser.:	Electrochemical Society Proceedings Series
Ser. no.:	2003-13

Conference Proceedings

3. Dielectric Glue Wafer Bonding and Bonded Wafer Thinning for Wafer-Level 3D Integration

Lu, J.-Q. ; Kwon, Y. ; Jindal, A. ; McMahon, J.J. ; Cale, T.S. ; Gutmann, R.J.

Pub. info.:	Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia. pp.76-86, 2003. Pennington, NJ. Electrochemical Society
Title of ser.:	Electrochemical Society Proceedings Series
Ser. no.:	2003-19

Conference Proceedings

4. Continuous Dynamic Recrystallization of AISI 430 Ferritic Stainless Steel by Hot Torsion Deformation

An, J. Y. ; Han, S. M. ; Kwon, Y. ; Yoo, Y. C.

Pub. info.:	PRICM 5 : the Fifth Pacific Rim International Conference on Advanced Materials and Processing, November 2-5, 2004, Beijing, Chin. pp.145-148, 2005. Uetikon-Zuerich. Trans Tech Publications
Title of ser.:	Materials science forum
Ser. no.:	475-479(1)

Conference Proceedings

5. Metal-oxide Semiconductor Field-effect Transistors using Single ZnO Nanowire

Heo, Young-Woo ; Kang, B. S. ; Tien, L. C. ; Kwon, Y. ; La-Roche, J. R. ; Gila, B. P. ; Ren, F. ; Pearton, S. J. ; Norton, D. P.

Pub. info.:	Progress in compound semiconductor materials -- electronic and optoelectronic applications. pp.327-332, 2004. Warrendale, Pa.. Materials Research Society
Title of ser.:	Materials Research Society symposium proceedings
Ser. no.:	829

Conference Proceedings

6. Wafer Thinning for Monolithic 3D Integration

Jindal, A. ; Lu, J. -Q. ; Kwon, Y. ; Rajagopalan, G. ; McMahon, J. J. ; Zeng, A. Y. ; Flesher, H. K. ; Cale, T. S. ; Gutmann, R. J.

Pub. info.:	Materials, Technology and Reliability for Advanced Interconnects and Low-k Dielectrics-2003 : symposium held April 21-25, 2003, San Francisco, California, U.S.A.. pp.21-26, 2003. Warrendale, Pa.. Materials Research Society
Title of ser.:	Materials Research Society symposium proceedings
Ser. no.:	766

Conference Proceedings

7. Dielectric Glue Wafer Bonding for 3D ICs

Kwon, Y. ; Jindal, A. ; McMahon, J. J. ; Lu, J. -Q. ; Gutmann, R. J. ; Cale, T. S.

Pub. info.:	Materials, Technology and Reliability for Advanced Interconnects and Low-k Dielectrics-2003 : symposium held April 21-25, 2003, San Francisco, California, U.S.A.. pp.27-32, 2003. Warrendale, Pa.. Materials Research Society
Title of ser.:	Materials Research Society symposium proceedings
Ser. no.:	766

Conference Proceedings

8. Wafer-Level 3D System-on-a-Chip using Dielectric Glue Wafer Bonding and Cu Damascene Inter-Wafer Interconnects

Lu, J.-Q. ; Jindal, A. ; Kwon, Y. ; McMahon, J.J. ; Lee, K.-W. ; Kraft, R.P. ; Altemus, B. ; Cheng, D. ; Eisenbraun, E. ; Cale, T.S. ; Gutmann, R.J

Pub. info.:	Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia. pp.87-95, 2003. Pennington, NJ. Electrochemical Society
Title of ser.:	Electrochemical Society Proceedings Series
Ser. no.:	2003-19

Conference Proceedings

9. Effect of Solution Heat Treatment on Microstructure and Mechanical Properties of Al Alloy FOAM

Lee, S. M. ; Ryu, K. ; Kwon, Y. ; Kim, J. G. ; Cho, W. S. ; Cho, N. H. ; Whang, C. M. ; Yoo, Y. C.

Pub. info.:	PRICM 5 : the Fifth Pacific Rim International Conference on Advanced Materials and Processing, November 2-5, 2004, Beijing, Chin. pp.437-440, 2005. Uetikon-Zuerich. Trans Tech Publications
Title of ser.:	Materials science forum
Ser. no.:	475-479(1)

10.

Conference Proceedings

10. Wafer Bonding Using Low-k Dielectrics aa Bonding Glue in Three-Dimensional Integration

Kwon, Y. ; Lu, J.-Q. ; Gutmann, R.J. ; Kraft, R.P. ; McDonald, J. ; Cale, T.S.

Pub. info.:	Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia. pp.145-154, 2001. Pennington, NJ. Electrochemical Society
Title of ser.:	Electrochemical Society Proceedings Series
Ser. no.:	2001-27

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