1.

Conference Proceedings
Conference Proceedings
1. Wafer Bonding and Thinning for 3D-IC Fabrication
Kwon, Y. ; Jindal, A. ; McMahon, J.J. ; Cale, T.S. ; Gutmann, R.J. ; Lu, J-Q.
Pub. info.: Thin film materials, processes, and reliability, plasma processing for the 100 nm node and copper interconnects with low-k inter-level dielectric films : proceedings of the international symposium.  pp.405-415,  2003.  Pennington, N.J..  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2003-13
2.

Conference Proceedings
Conference Proceedings
2. 3D System-on-a-Chip Using Dielectric Glue Bonding and Cu Damascene Inter-Wafer Interconnects
Lu, J.-Q. ; Jindal, A. ; Kwon, Y. ; McMahon, J.J. ; Lee, K-W. ; Craft, R.P. ; Altemus, B. ; Cheng, D. ; Eisenbraum, E. ; Cale, T.S. ; Gutmann, R.J.
Pub. info.: Thin film materials, processes, and reliability, plasma processing for the 100 nm node and copper interconnects with low-k inter-level dielectric films : proceedings of the international symposium.  pp.381-389,  2003.  Pennington, N.J..  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2003-13
3.

Conference Proceedings
Conference Proceedings
3. Dielectric Glue Wafer Bonding and Bonded Wafer Thinning for Wafer-Level 3D Integration
Lu, J.-Q. ; Kwon, Y. ; Jindal, A. ; McMahon, J.J. ; Cale, T.S. ; Gutmann, R.J.
Pub. info.: Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia.  pp.76-86,  2003.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2003-19
4.

Conference Proceedings
Conference Proceedings
4. Wafer Thinning for Monolithic 3D Integration
Jindal, A. ; Lu, J. -Q. ; Kwon, Y. ; Rajagopalan, G. ; McMahon, J. J. ; Zeng, A. Y. ; Flesher, H. K. ; Cale, T. S. ; Gutmann, R. J.
Pub. info.: Materials, Technology and Reliability for Advanced Interconnects and Low-k Dielectrics-2003 : symposium held April 21-25, 2003, San Francisco, California, U.S.A..  pp.21-26,  2003.  Warrendale, Pa..  Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 766
5.

Conference Proceedings
Conference Proceedings
5. Dielectric Glue Wafer Bonding for 3D ICs
Kwon, Y. ; Jindal, A. ; McMahon, J. J. ; Lu, J. -Q. ; Gutmann, R. J. ; Cale, T. S.
Pub. info.: Materials, Technology and Reliability for Advanced Interconnects and Low-k Dielectrics-2003 : symposium held April 21-25, 2003, San Francisco, California, U.S.A..  pp.27-32,  2003.  Warrendale, Pa..  Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 766
6.

Conference Proceedings
Conference Proceedings
6. Wafer-Level 3D System-on-a-Chip using Dielectric Glue Wafer Bonding and Cu Damascene Inter-Wafer Interconnects
Lu, J.-Q. ; Jindal, A. ; Kwon, Y. ; McMahon, J.J. ; Lee, K.-W. ; Kraft, R.P. ; Altemus, B. ; Cheng, D. ; Eisenbraun, E. ; Cale, T.S. ; Gutmann, R.J
Pub. info.: Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia.  pp.87-95,  2003.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2003-19