1.

Conference Proceedings

Conference Proceedings
Wiemer, M. ; Hiller, K. ; Hahn, R. ; Kaufmann, C. ; Gessner, T.
Pub. info.: Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia.  pp.368-380,  1999.  Pennington, N.J..  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 99-35
2.

Conference Proceedings

Conference Proceedings
Wiemer, M. ; Zimmermann, S. ; Zhao, Q.T. ; Trui, B. ; Kaufmann, C. ; Mantl, S. ; Dudek, V. ; Gessner, T.
Pub. info.: Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia.  pp.303-310,  2005.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2005-02
3.

Technical Paper

Technical Paper
Carriere, A. ; Kaufmann, C. ; Shapiro, J. ; Paine, P. ; Prinsen, J. H.
Pub. info.: 2000 SAE world congress : technical paper.  pp.1-10,  2000.  Warrendale, Penn..  Society of Automotive Engineers
Title of ser.: Society of Automotive Engineers technical paper series
Ser. no.: 2000
4.

Conference Proceedings

Conference Proceedings
Kurth, S. ; Kaufmann, C. ; Hahn, R. ; Mehner, J. ; Dotzel, W. ; Gessner, T.
Pub. info.: MOEMS Display and Imaging Systems III.  pp.23-33,  2005.  Bellingham, Wash..  SPIE - The International Society of Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 5721
5.

Technical Paper

Technical Paper
Williams, J. ; Kaufmann, C.
Pub. info.: SME technical paper.  2005.  Society of Manufacturing Engineers