1.

Conference Proceedings
Conference Proceedings
1. Application of High and Low Wafer Bonding Processes for Bulk Micromachined Components
Wiemer, M. ; Hiller, K. ; Hahn, R. ; Kaufmann, C. ; Gessner, T.
Pub. info.: Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia.  pp.368-380,  1999.  Pennington, N.J..  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 99-35
2.

Conference Proceedings
Conference Proceedings
2. A novel 24-kHz resonant scanner for high-resolution laser display
Kurth, S. ; Kaufmann, C. ; Hahn, R. ; Mehner, J. ; Dotzel, W. ; Gessner, T.
Pub. info.: MOEMS Display and Imaging Systems III.  pp.23-33,  2005.  Bellingham, Wash..  SPIE - The International Society of Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 5721