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Wafer Bonding: a Flexible Way to Manufacture SOI Materials for High Performance Applications (Invited)

Author(s):
Publication title:
Microelectronics technology and devices : SBMICRO 2004 : proceedings of the nineteenth international symposium
Title of ser.:
Electrochemical Society Proceedings Series
Ser. no.:
2004-03
Pub. Year:
2004
Page(from):
241
Page(to):
252
Pages:
12
Pub. info.:
Pennington, N.J.: Electrochemical Society
ISSN:
01616374
ISBN:
9781566774161 [1566774160]
Language:
English
Call no.:
E23400/200403
Type:
Conference Proceedings

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