Wafer Bonding: a Flexible Way to Manufacture SOI Materials for High Performance Applications (Invited)
- Author(s):
- Publication title:
- Microelectronics technology and devices : SBMICRO 2004 : proceedings of the nineteenth international symposium
- Title of ser.:
- Electrochemical Society Proceedings Series
- Ser. no.:
- 2004-03
- Pub. Year:
- 2004
- Page(from):
- 241
- Page(to):
- 252
- Pages:
- 12
- Pub. info.:
- Pennington, N.J.: Electrochemical Society
- ISSN:
- 01616374
- ISBN:
- 9781566774161 [1566774160]
- Language:
- English
- Call no.:
- E23400/200403
- Type:
- Conference Proceedings
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