Advanced RELACS (resolution enhancment of lithography by assist of chemical shrink) material for 193-nm lithography
- Author(s):
Hong, S. ( Clariant Japan K.K. (Japan) ) Takano, Y. ( Clariant Japan K.K. (Japan) ) Kanda, T. ( IMEC (Belgium) ) Kudo, T. ( Clariant Corp. (USA) ) Padmanaban, M. ( Clariant Corp. (USA) ) Tanaka, H. ( Clariant Japan K.K. (Japan) ) Lee, S.-H. ( Samsung Electronics Co., Ltd. (South Korea) ) Lee, J.-H. ( Samsung Electronics Co., Ltd. (South Korea) ) Woo, S.-G. ( Samsung Electronics Co., Ltd. (South Korea) ) - Publication title:
- Advances in Resist Technology and Processing XX
- Title of ser.:
- Proceedings of SPIE - the International Society for Optical Engineering
- Ser. no.:
- 5039
- Pub. Year:
- 2003
- Vol.:
- 1
- Pt.:
- Session 5
- Page(from):
- 195
- Page(to):
- 206
- Pages:
- 12
- Pub. info.:
- Bellingham, CA: SPIE-The International Society for Optical Engineering
- ISSN:
- 0277786X
- ISBN:
- 9780819448446 [0819448443]
- Language:
- English
- Call no.:
- P63600/5039
- Type:
- Conference Proceedings
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