Blank Cover Image

MATERIALS AND STRUCTURES FOR HIGH DENSITY I/O INTERCONNECTION SYSTEMS

Author(s):
Publication title:
Electronic packaging materials science III : symposium held November 30-December 4, 1987, Boston, Massachusetts, U.S.A.
Title of ser.:
Materials Research Society symposium proceedings
Ser. no.:
108
Pub. Year:
1988
Page(from):
309
Page(to):
318
Pages:
10
Pub. info.:
Pittsburgh, Pa.: Materials Research Society
ISSN:
02729172
ISBN:
9780931837760 [0931837766]
Language:
English
Call no.:
M23500/108
Type:
Conference Proceedings

Similar Items:

Weihs, T.P., Hong, S., Bravman, J.C., Nix, W.D.

Materials Research Society

Robin, F., Erni, D., Costea, S., Cristea, P., Cui, X., Fedoryshyn, Y., Gini, E., Hafner, C., Harbers, R., Holzman, J., …

SPIE - The International Society of Optical Engineering

Hong, S., Weihs, T.P., Bravman, J.C., Nix, W.D.

Materials Research Society

Vinci, R. P., Bravman, J. C.

MRS - Materials Research Society

Vinci, R. P., Weihs, T. P., Zielinski, E. M., Barbee, T. W., Jr., Bravman, J. C.

MRS - Materials Research Society

Vinci, R. P., Bravman, J. C.

MRS - Materials Research Society

Khanna,P.K., Bhatnagar,S.K., Sommadossi,S., Gust,W., Mittemeijer,E J.

SPIE - The International Society for Optical Engineering

Kwon, H.-D., Song, T.S., Kim, W.-J., Park, N.-C., Park, Y.-P.

SPIE-The International Society for Optical Engineering

Streffer, S. K., Lairson, B. M., Eom, C. B., Marshall, A. F., Bravman, J. C., Geballe, T. H.

Materials Research Society

J. O. Park, S. Hong, T. Kim, K. Kwon, S. Suh, M. Cho, D. Yoo

Electrochemical Society

Cho, K. W., Kim, N. K., Oh, S. H., Choi, E. S., Sun, H. J., Yeom, S. J., Lee, K. N., Lee, S. S., Hong, S. K., Choi, S. …

Trans Tech Publications

Lee, S., Bravman, J. C., Flinn, P. A., Marieb, T. N.

MRS - Materials Research Society

1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12