1.

Conference Proceedings
Conference Proceedings
1. Silver Metallization With Reactively Sputtered TiN Diffusion Barrier Films
Gao, L. ; Gstottner, J. ; Emling, R. ; Linsmeier, Ch. ; Balden, M. ; Wiltner, A. ; Hansch, W. ; Schmitt-Landsiedel, D.
Pub. info.: Materials, technology and reliability for advanced interconnects and low-k dielectrics - 2004 : symposium held April 13-15, 2004, San Francisco, California, U.S.A..  pp.255-260,  2004.  Warrendale.  Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 812
2.

Conference Proceedings
Conference Proceedings
2. Silver Patterning by Reactive Ion Beam Etching for Microelectronics Application
Gao, L. ; Gstoettner, J. ; Emling, R. ; Wang, P. ; Hansch, W. ; Schmitt-Landsiedel, D.
Pub. info.: Materials, technology and reliability for advanced interconnects and low-k dielectrics - 2004 : symposium held April 13-15, 2004, San Francisco, California, U.S.A..  pp.185-190,  2004.  Warrendale.  Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 812