Variation of Heat Dissipation Properties of LED Packages with Thermal Vias

Variation of Heat Dissipation Properties of LED Packages with Thermal Vias

Author(s):

Publication title:

PRICM 7 : selected peer review papers from the seventh Pacific Rim International Conference on Advanced Materials and Processing, August 2-6, 2010, Cairns, Australia

Title of ser.:

Materials science forum

Ser. no.:

654-656

Pub. Year:

2010

Pt.:

3

Page(from):

2811

Page(to):

2814

Pages:

4

Pub. info.:

Aedermannsdorf, Switzerland: Trans Tech Publications

ISSN:

02555476

Language:

English

Call no.:

M23650

Type:

Conference Proceedings

Details

TDL ID:	ZA00054161
Series ID:	PA00000012
Conf. info. (Name):	Pacific Rim International Conference on Advanced Materials and Processing
Conf. info. (Number):	7th
Conf. info. (Venue):	Cairns, Australia
Conf. info. (Date):	2010.08.02-2010.08.06
Note for article:	Seventh Pacific Rim International Conference on Advanced Materials and Processing, August 2-6, 2010, Cairns, Australia

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