Blank Cover Image

Fabrication and Properties of a Combined Structural Cu Sheet for Interconnect Material

Author(s):
Publication title:
PRICM 7 : selected peer review papers from the seventh Pacific Rim International Conference on Advanced Materials and Processing, August 2-6, 2010, Cairns, Australia
Title of ser.:
Materials science forum
Ser. no.:
654-656
Pub. Year:
2010
Pt.:
3
Page(from):
2728
Page(to):
2731
Pages:
4
Pub. info.:
Aedermannsdorf, Switzerland: Trans Tech Publications
ISSN:
02555476
Language:
English
Call no.:
M23650
Type:
Conference Proceedings

Similar Items:

H.K. Moon, S.B. Jung, J.S. Shin

Trans Tech Publications

H.S. Kim, J.K. Lee, S.Y. Shin, T.S. Kim

Trans Tech Publications

S.C. Lim, K.H. Kim, H.B. Lee, H.S. Lee, H.C. Kwon

Trans Tech Publications

J.S. Shin, B.H. Kim, J.G. Lee, S.Y. Shin, G.B. Choi

Trans Tech Publications

J.S. Shin, B.H. Kim, S.M. Lee, B.M. Moon

Trans Tech Publications

B.H. Kim, J.S. Shin, D.S. Kim, K.Y. Kim, I.J. Shon

Trans Tech Publications

B.S. Jang, C.H. Lee, J.W. Choi, J.S. Kwon, H.K. Kim

Trans Tech Publications

J. Kim, C. Lee, A. Kim, S. Kim

Electrochemical Society

Jung, T.K., Lim, S.C., Kwon, H.C., Kim, M.S.

Trans Tech Publications

Lee, J.S., Shin, K.H., Shin, M.C., Cho, D.H., Lee, H.S.

Trans Tech Publications

B.S. Jang, C.H. Lee, J.W. Choi, J.S. Kwon, H.K. Kim, C.H. Park, H.M. Kim

Trans Tech Publications

Kim, Y. K., Joung, Y. G., Song, J. B., Shin, M. C., Lee, H. S.

Trans Tech Publications

1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12