1.

Conference Proceedings
Conference Proceedings
1. ZONE-MELTING RECRYSTALLIZATION OF SILICON ON ALUMINA
Letavic, T. J. ; Malby, E. W. ; Gutmann, R. J.
Pub. info.: Silicon-on-insulator and buried metals in semiconductors : symposium held November 30-December 3, 1987, Boston, Massachusetts, U.S.A..  pp.183-188,  1988.  Pittsburgh, Pa..  Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 107
2.

Conference Proceedings
Conference Proceedings
2. MEASUREMENT OF VISCOELASTIC STRESS RELIEF IN PATTERNED SILICON-ON-INSULATOR COMPOSITE STRUCTURES WITH RAMAN SPECTROSCOPY
Letavic, T. J. ; Maby, E. W. ; Gutmann, R. J. ; Petruzzello, J.
Pub. info.: Thin films : stresses and mechanical properties III : symposium held December 2-5, 1991, Boston, Massachusetts, U.S.A..  pp.201-206,  1992.  Pittsburgh, Pa..  Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 239
3.

Conference Proceedings
Conference Proceedings
3. Investigations of the Chemical-Mechanical Polishing of Polymer Films for ILD Applications
Neirynck, Jan M. ; Murarka, S. P. ; Gutmann, R. J.
Pub. info.: Low-dielectric constant materials : synthesis and applications in microelectronics : symposium held April 17-19, 1995, San Francisco, California, U.S.A..  pp.229-,  1995.  Pittsburgh, Pa..  MRS - Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 381
4.

Conference Proceedings
Conference Proceedings
4. *Microstructural characterization of antimonide based III-V compounds and their effect on electro-optical properties of substrate materials and devices
Dutta, P. S. ; Gutmann, R. J. ; Charache, G. W. ; Wang, C. A.
Pub. info.: Optical microstructural characterization of semiconductors : sympoisum held November 29-30, 1999, Boston, Massachusetts, U.S.A..  pp.187-,  2000.  Warrendale, Pa..  MRS-Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 588
5.

Conference Proceedings
Conference Proceedings
5. CHEMICAL-MECHANICAL POLISHING OF TUNGSTEN WITH HOLOGEN-BASED SLURRIES
Yang, K. ; Gutmann, R. J. ; Murarka, S. P. ; Stonebaker, E. ; Atkins, H.
Pub. info.: Advanced metallization for devices and circuits--science, technology, and manufacturability : symposium held April 4-8, 1994, San Francisco, California, U.S.A..  pp.145-,  1994.  Pittsburgh, Pa..  MRS - Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 337
6.

Conference Proceedings
Conference Proceedings
6. Bias-temperature-stress induced mobility improvement in 4H-SiC MOSFETs
Chatty, K. ; Chow, T. P. ; Gutmann, R. J. ; Arnold, E. ; Alok, D.
Pub. info.: Wide-bandgap semiconductors for high-power, high-frequency, and high temperature applications--1999 : symposium held April 5-8, 1999, San Francisco, California, U.S.A..  pp.63-,  1999.  Warrendale, PA.  MRS-Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 572
7.

Conference Proceedings
Conference Proceedings
7. Recombination Parameters in InGaAsSb Epitaxial Layers for Thermophotovoltaic Applications
Kumar, R. J. ; Gutmann, R. J. ; Borrego, J. M. ; Dutta, P. S. ; Wang, C. A. ; Martinelli, R. U. ; Nichols, G.
Pub. info.: Compound semiconductor photovoltaics : symposium held April 22-25, 2003, San Francisco, California, U.S.A..  pp.73-78,  2003.  Warrendale, Pa..  Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 763
8.

Conference Proceedings
Conference Proceedings
8. Die-on-Wafer and Wafer-Level Three-Dimensional (3D) Integration of Heterogeneous IC Technologies for RF-Microwave-Millimeter Applications
Lu, J. Q. ; Devarajan, S. ; Zeng, A. Y. ; Rose, K. ; Gutmann, R. J.
Pub. info.: Materials, integration and packaging issues for high-frequency devices.  pp.229-234,  2004.  Warrendale, Pa..  Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 833
9.

Conference Proceedings
Conference Proceedings
9. 200mm Silicon Wafer-to-Wafer Bonding with Thin Ti Layer under BEOL-Compatible Process Conditions
Yu, J. ; McMahon, J. J. ; Lu, J. Q. ; Gutmann, R. J.
Pub. info.: Surface engineering 2004 - fundamentals and applications : symposium held November 30-December 2, 2004, Boston, Massachusetts, U.S.A..  pp.305-310,  2005.  Warrendale, Pa..  Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 843
10.

Conference Proceedings
Conference Proceedings
10. Nitrogen vs. Phosphorus as Implant Species for High-Voltage Lateral RESURF MOSFETs on 4H-SiC
Chatty, K. ; Banerjee, S. ; Chow, T. P. ; Gutmann, R. J.
Pub. info.: Silicon carbide and related materials - 1999 : ICSCRM'99, proceedings of the International Conference on Silicon Carbide and Related Materials - 1999, Research Triangle Park, North Carolina, USA, October 10-15, 1999.  pp.1279-1282,  2000.  Zuerich, Switzerland.  Trans Tech Publications
Title of ser.: Materials science forum
Ser. no.: 338-342(2)
11.

Conference Proceedings
Conference Proceedings
11. Dielectric Adhesive Wafer Bonding for Back-End Wafer-Level 3D Hyper-Integration
Lu, J. -Q. ; Caleand, T. S. ; Gutmann, R. J.
Pub. info.: Dielectrics for nanosystems: materials science, processing, reliability, and manufacturing : proceedings of the First international symposium.  pp.312-323,  2004.  Pennington, N.J..  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2004-04
12.

Conference Proceedings
Conference Proceedings
12. Electrical Characteristics and Reliability of 4H-SiC PiN Diodes Fabricated on In-House Grown and Commercial Epitaxial Films
Losee, P. A. ; Li, C. ; Seiler, J. ; Stahlbush, R. E. ; Chow, T. P. ; Bhat, I. B. ; Gutmann, R. J.
Pub. info.: Silicon carbide and related materials 2004 : ECSCRM 2004 : proceedings of the 5th European Conference on Silicon Carbide and Related Materials, August 31 - September 4 2004, Bologna, Italy.  pp.961-964,  2005.  Uetikon-Zuerich.  Trans Tech Publications
Title of ser.: Materials science forum
Ser. no.: 483-485
13.

Conference Proceedings
Conference Proceedings
13. Wafer Thinning for Monolithic 3D Integration
Jindal, A. ; Lu, J. -Q. ; Kwon, Y. ; Rajagopalan, G. ; McMahon, J. J. ; Zeng, A. Y. ; Flesher, H. K. ; Cale, T. S. ; Gutmann, R. J.
Pub. info.: Materials, Technology and Reliability for Advanced Interconnects and Low-k Dielectrics-2003 : symposium held April 21-25, 2003, San Francisco, California, U.S.A..  pp.21-26,  2003.  Warrendale, Pa..  Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 766
14.

Conference Proceedings
Conference Proceedings
14. Dielectric Glue Wafer Bonding for 3D ICs
Kwon, Y. ; Jindal, A. ; McMahon, J. J. ; Lu, J. -Q. ; Gutmann, R. J. ; Cale, T. S.
Pub. info.: Materials, Technology and Reliability for Advanced Interconnects and Low-k Dielectrics-2003 : symposium held April 21-25, 2003, San Francisco, California, U.S.A..  pp.27-32,  2003.  Warrendale, Pa..  Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 766
15.

Conference Proceedings
Conference Proceedings
15. Slurries for Copper Damascene Patterning: Similarities and Differences
Jindal, A. ; Rajagopalan, G. ; Gupta, M. ; Lu, J. -Q. ; Rose, K. ; Gutmann, R. J.
Pub. info.: Chemical-mechanical planarization : symposium held April 22-24, 2003, San Francisco, California, U.S.A..  pp.285-290,  2003.  Warrendale, Pa..  Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 767
16.

Conference Proceedings
Conference Proceedings
16. Comparison of Nitrogen and Phosphorus Implanted, Planar, High-Voltage 4H-SiC Junction Rectifiers
Chatty, K. ; Khemka, V. ; Chow, T. P. ; Gutmann, R. J.
Pub. info.: Silicon carbide and related materials - 1999 : ICSCRM'99, proceedings of the International Conference on Silicon Carbide and Related Materials - 1999, Research Triangle Park, North Carolina, USA, October 10-15, 1999.  pp.1331-1334,  2000.  Zuerich, Switzerland.  Trans Tech Publications
Title of ser.: Materials science forum
Ser. no.: 338-342(2)
17.

Conference Proceedings
Conference Proceedings
17. Breakdown Voltage Improvement of 4H-SiC Schottky Diodes by a Thin Surface Implant
Khemka, V. ; Chatty, K. ; Chow, T. P. ; Gutmann, R. J.
Pub. info.: Silicon carbide and related materials - 1999 : ICSCRM'99, proceedings of the International Conference on Silicon Carbide and Related Materials - 1999, Research Triangle Park, North Carolina, USA, October 10-15, 1999.  pp.1211-1214,  2000.  Zuerich, Switzerland.  Trans Tech Publications
Title of ser.: Materials science forum
Ser. no.: 338-342(2)
18.

Conference Proceedings
Conference Proceedings
18. Characterization of 4H-SiC Epitaxial Layers by Microwave Photoconductivity Decay
Kumar, R. J. ; Losee, P. A. ; Li, C. ; Seiler, J. ; Bhat, I. B. ; Chow, T. P. ; Borrego, J. M. ; Gutmann, R. J.
Pub. info.: Silicon carbide and related materials 2004 : ECSCRM 2004 : proceedings of the 5th European Conference on Silicon Carbide and Related Materials, August 31 - September 4 2004, Bologna, Italy.  pp.405-408,  2005.  Uetikon-Zuerich.  Trans Tech Publications
Title of ser.: Materials science forum
Ser. no.: 483-485
19.

Conference Proceedings
Conference Proceedings
19. SURFACE LAYER FORMATION DURING THE CHEMICAL MECHANICAL POLISHING OF COPPER THIN FILMS
Steigerwald, J. M. ; Murarka, S. P. ; Duquette, D. J. ; Gutmann, R. J.
Pub. info.: Advanced metallization for devices and circuits--science, technology, and manufacturability : symposium held April 4-8, 1994, San Francisco, California, U.S.A..  pp.133-,  1994.  Pittsburgh, Pa..  MRS - Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 337