1.

Conference Proceedings
Conference Proceedings
1. 200mm Silicon Wafer-to-Wafer Bonding with Thin Ti Layer under BEOL-Compatible Process Conditions
Yu, J. ; McMahon, J. J. ; Lu, J. Q. ; Gutmann, R. J.
Pub. info.: Surface engineering 2004 - fundamentals and applications : symposium held November 30-December 2, 2004, Boston, Massachusetts, U.S.A..  pp.305-310,  2005.  Warrendale, Pa..  Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 843
2.

Conference Proceedings
Conference Proceedings
2. Wafer Thinning for Monolithic 3D Integration
Jindal, A. ; Lu, J. -Q. ; Kwon, Y. ; Rajagopalan, G. ; McMahon, J. J. ; Zeng, A. Y. ; Flesher, H. K. ; Cale, T. S. ; Gutmann, R. J.
Pub. info.: Materials, Technology and Reliability for Advanced Interconnects and Low-k Dielectrics-2003 : symposium held April 21-25, 2003, San Francisco, California, U.S.A..  pp.21-26,  2003.  Warrendale, Pa..  Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 766
3.

Conference Proceedings
Conference Proceedings
3. Dielectric Glue Wafer Bonding for 3D ICs
Kwon, Y. ; Jindal, A. ; McMahon, J. J. ; Lu, J. -Q. ; Gutmann, R. J. ; Cale, T. S.
Pub. info.: Materials, Technology and Reliability for Advanced Interconnects and Low-k Dielectrics-2003 : symposium held April 21-25, 2003, San Francisco, California, U.S.A..  pp.27-32,  2003.  Warrendale, Pa..  Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 766