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Conference Proceedings
Conference Proceedings
1. Wafer Bonding for Patterning of Micromechanical Sensors
Wierner, M. ; Hiller, K. ; Gessner, T.
Pub. info.: Proceedings of the Fourth International Symposium on Semiconductor Wafer Bonding : science, technology, and applications.  pp.138-146,  1997.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 97-36
2.

Conference Proceedings
Conference Proceedings
2. Application of High and Low Wafer Bonding Processes for Bulk Micromachined Components
Wiemer, M. ; Hiller, K. ; Hahn, R. ; Kaufmann, C. ; Gessner, T.
Pub. info.: Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia.  pp.368-380,  1999.  Pennington, N.J..  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 99-35
3.

Conference Proceedings
Conference Proceedings
3. Frequency-selective silicon vibration sensor with direct electrostatic stiffness modulation
Scheibner, D. ; Wibbeler, J. ; Mehner, J. ; Braemer, B. ; Gessner, T. ; Doetzel, W.
Pub. info.: Design, test, integration, and packaging of MEMS/MOEMS 2002 : 6-8 May, 2002, Cannes, France.  pp.325-332,  2002.  Bellingham, Wash..  SPIE-The International Society for Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 4755
4.

Conference Proceedings
Conference Proceedings
4. Trapping Behavior of Thin Siliconoxynitride Layers Prepared by Rapid Thermal Processing
Beyer, R. ; Burghardt, H. ; Reich, R. ; Thomas, E. ; Grambole, D. ; Herrmann, F. ; Scholz, T. ; Albrecht, J. ; Zahn, D. R. T. ; Gessner, T.
Pub. info.: Materials reliability in microelectronics VI : symposium held April 8-12, 1996, San Francisco, California, U.S.A..  pp.421-,  1996.  Pittsburgh, Pa..  MRS - Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 428
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Conference Proceedings
Conference Proceedings
5. Fabrication of SOI Substrates with Buried Silicide Layers for BiCMOS Applications
Wiemer, M. ; Zimmermann, S. ; Zhao, Q.T. ; Trui, B. ; Kaufmann, C. ; Mantl, S. ; Dudek, V. ; Gessner, T.
Pub. info.: Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia.  pp.303-310,  2005.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2005-02
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Conference Proceedings
Conference Proceedings
6. Bonding and Contacting of MEMS-Structures on Wafer Level
Wiemer, M. ; Fromel, J. ; Jia, C. ; Gessner, T.
Pub. info.: Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia.  pp.301-308,  2003.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2003-19
7.

Conference Proceedings
Conference Proceedings
7. Deposition and Treatment of Titanium Based Bamer Layers by MOCVD
Ecke, R. ; Schulz, S.E. ; Gessner, T. ; Riedel, S. ; Lipp, E. ; Eizenberg, M.
Pub. info.: Chemical vapor deposition XVI and EUROCVD 14 : proceedings of the international symposium.  pp.1224-1230,  2003.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2003-8
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Conference Proceedings
Conference Proceedings
8. Stress-Caused Deflections of Asymmetrical Coated Single-Crystal Silicon Elements
Kuechler, M. ; Griesbach, K. ; Bertz, A. ; Gessner, T. ; Faust, T. ; Dudek, R.
Pub. info.: Materials science of microelectromechanical systems (MEMS) devices : symposium held December 1-2, 1998, Boston, Massachusetts, U.S.A..  pp.33-38,  1999.  Warrendale, Pa..  Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 546
9.

Conference Proceedings
Conference Proceedings
9. Bonding and Metallization for a High Precision Acceleration Sensor
Gessner, T. ; Wiemer, M. ; Hiller, K. ; Hafen, M.
Pub. info.: Proceedings of the Second International Symposium on Microstructures and Microfabricated Systems.  pp.297-308,  1995.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 95-27
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Conference Proceedings
Conference Proceedings
10. Novel Hadamard transform spectrometer realized using a dynamically driven micromirror array as a light modulator
Hanf, M. ; Schaporin, A.V. ; Hahn, R. ; Dotzel, W. ; Gessner, T.
Pub. info.: MEMS/MOEMS Components and Their Applications II.  pp.117-126,  2005.  Bellingham, Wash..  SPIE - The International Society of Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 5717
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Conference Proceedings
Conference Proceedings
11. Mechanical reliabilty of MEMS fabricated by a special technology using standard silicon wafers
Lohmann, C. ; Bertz, A. ; Kuechler, M. ; Reuter, D. ; Gessner, T.
Pub. info.: Reliability, Testing, and Characterization of MEMS/MOEMS II.  pp.200-207,  2003.  Bellingham, Wash..  SPIE-The International Society for Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 4980
12.

Conference Proceedings
Conference Proceedings
12. Application of micromirror arrays for Hadamard transform optics
Hanf, M. ; Kurth, S. ; Billep, D. ; Hahn, R. ; Faust, W. ; Heinz, S. ; Doetzel, W. ; Gessner, T.
Pub. info.: Microwave and Optical Technology 2003.  pp.128-131,  2004.  Bellingham, Wash..  SPIE - The International Society of Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 5445
13.

Conference Proceedings
Conference Proceedings
13. Packaging and characterization of micro-opto-electro-mechanical systems
Saupe, R. ; Otto, T. ; Stock, V. ; Fritzsch, U. ; Gessner, T.
Pub. info.: Microwave and Optical Technology 2003.  pp.152-155,  2004.  Bellingham, Wash..  SPIE - The International Society of Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 5445
14.

Conference Proceedings
Conference Proceedings
14. An electrically tunable infrared filter on base of Fabry-Perot interferometer
Kurth, S. ; Hiller, K. ; Neumann, N. ; Heinze, M. ; Doetzel, W. ; Gessner, T.
Pub. info.: Microwave and Optical Technology 2003.  pp.95-100,  2004.  Bellingham, Wash..  SPIE - The International Society of Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 5445
15.

Conference Proceedings
Conference Proceedings
15. Tunable Fabry-Perot interferometer for 3- to 4.5-μm wavelength with bulk micromachined reflector carrier
Kurth, S. ; Hiller, K. ; Neumann, N. ; Heinze, M. ; Doetzel, W. ; Gessner, T.
Pub. info.: MOEMS and Miniaturized Systems III.  pp.215-226,  2003.  Bellingham, Wash..  SPIE-The International Society for Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 4983
16.

Conference Proceedings
Conference Proceedings
16. Bonding and deep RIE: a powerful combination for high-aspect-ratio sensors and actuators
Hiller, K. ; Kuchler, M. ; Billep, D. ; Schroter, B. ; Dienel, M. ; Scheibner, D. ; Gessner, T.
Pub. info.: Micromachining and Microfabrication Process Technology X.  pp.80-91,  2005.  Bellingham, Wash..  SPIE - The International Society of Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 5715
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Conference Proceedings
Conference Proceedings
17. Packaging and characterization of miniaturized spectral sensing devices
Otto, T. ; Saupe, R. ; Stock, V. ; Fritzsch, U. ; Bruch, R.F. ; Gessner, T.
Pub. info.: MOEMS and Miniaturized Systems IV.  pp.134-140,  2004.  Bellingham, Wash..  SPIE - The International Society of Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 5346
18.

Conference Proceedings
Conference Proceedings
18. A novel dual-detector micro-spectrometer
Otto, T. ; Saupe, R. ; Stock, V. ; Bruch, R. ; Gruska, B. ; Gessner, T.
Pub. info.: MOEMS and Miniaturized Systems V.  pp.76-82,  2005.  Bellingham, Wash..  SPIE - The International Society of Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 5719
19.

Conference Proceedings
Conference Proceedings
19. Selective adhesive bonding with SU-8 for zero-level-packaging
Reuter, D. S. ; Bertz, A. ; Schwenzer, G. ; Gessner, T.
Pub. info.: Micro- and Nanotechnology: Materials, Processes, Packaging, and Systems II.  pp.163-171,  2004.  Bellingham, Wash..  SPIE - The International Society of Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 5650
20.

Conference Proceedings
Conference Proceedings
20. A novel 24-kHz resonant scanner for high-resolution laser display
Kurth, S. ; Kaufmann, C. ; Hahn, R. ; Mehner, J. ; Dotzel, W. ; Gessner, T.
Pub. info.: MOEMS Display and Imaging Systems III.  pp.23-33,  2005.  Bellingham, Wash..  SPIE - The International Society of Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 5721