1.

Conference Proceedings

Conference Proceedings
Wierner, M. ; Hiller, K. ; Gessner, T.
Pub. info.: Proceedings of the Fourth International Symposium on Semiconductor Wafer Bonding : science, technology, and applications.  pp.138-146,  1997.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 97-36
2.

Conference Proceedings

Conference Proceedings
Wiemer, M. ; Hiller, K. ; Hahn, R. ; Kaufmann, C. ; Gessner, T.
Pub. info.: Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia.  pp.368-380,  1999.  Pennington, N.J..  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 99-35
3.

Conference Proceedings

Conference Proceedings
Scheibner, D. ; Wibbeler, J. ; Mehner, J. ; Braemer, B. ; Gessner, T. ; Doetzel, W.
Pub. info.: Design, test, integration, and packaging of MEMS/MOEMS 2002 : 6-8 May, 2002, Cannes, France.  pp.325-332,  2002.  Bellingham, Wash..  SPIE-The International Society for Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 4755
4.

Conference Proceedings

Conference Proceedings
Beyer, R. ; Burghardt, H. ; Reich, R. ; Thomas, E. ; Grambole, D. ; Herrmann, F. ; Scholz, T. ; Albrecht, J. ; Zahn, D. R. T. ; Gessner, T.
Pub. info.: Materials reliability in microelectronics VI : symposium held April 8-12, 1996, San Francisco, California, U.S.A..  pp.421-,  1996.  Pittsburgh, Pa..  MRS - Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 428
5.

Conference Proceedings

Conference Proceedings
Wiemer, M. ; Zimmermann, S. ; Zhao, Q.T. ; Trui, B. ; Kaufmann, C. ; Mantl, S. ; Dudek, V. ; Gessner, T.
Pub. info.: Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia.  pp.303-310,  2005.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2005-02
6.

Conference Proceedings

Conference Proceedings
Wiemer, M. ; Fromel, J. ; Jia, C. ; Gessner, T.
Pub. info.: Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia.  pp.301-308,  2003.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2003-19
7.

Conference Proceedings

Conference Proceedings
Ecke, R. ; Schulz, S.E. ; Gessner, T. ; Riedel, S. ; Lipp, E. ; Eizenberg, M.
Pub. info.: Chemical vapor deposition XVI and EUROCVD 14 : proceedings of the international symposium.  pp.1224-1230,  2003.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2003-8
8.

Conference Proceedings

Conference Proceedings
Kuechler, M. ; Griesbach, K. ; Bertz, A. ; Gessner, T. ; Faust, T. ; Dudek, R.
Pub. info.: Materials science of microelectromechanical systems (MEMS) devices : symposium held December 1-2, 1998, Boston, Massachusetts, U.S.A..  pp.33-38,  1999.  Warrendale, Pa..  Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 546
9.

Conference Proceedings

Conference Proceedings
Gessner, T. ; Wiemer, M. ; Hiller, K. ; Hafen, M.
Pub. info.: Proceedings of the Second International Symposium on Microstructures and Microfabricated Systems.  pp.297-308,  1995.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 95-27
10.

Conference Proceedings

Conference Proceedings
Hanf, M. ; Schaporin, A.V. ; Hahn, R. ; Dotzel, W. ; Gessner, T.
Pub. info.: MEMS/MOEMS Components and Their Applications II.  pp.117-126,  2005.  Bellingham, Wash..  SPIE - The International Society of Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 5717