1.

Conference Proceedings
Conference Proceedings
1. Wafer Bonding for Patterning of Micromechanical Sensors
Wierner, M. ; Hiller, K. ; Gessner, T.
Pub. info.: Proceedings of the Fourth International Symposium on Semiconductor Wafer Bonding : science, technology, and applications.  pp.138-146,  1997.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 97-36
2.

Conference Proceedings
Conference Proceedings
2. Application of High and Low Wafer Bonding Processes for Bulk Micromachined Components
Wiemer, M. ; Hiller, K. ; Hahn, R. ; Kaufmann, C. ; Gessner, T.
Pub. info.: Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia.  pp.368-380,  1999.  Pennington, N.J..  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 99-35
3.

Conference Proceedings
Conference Proceedings
3. Bonding and Metallization for a High Precision Acceleration Sensor
Gessner, T. ; Wiemer, M. ; Hiller, K. ; Hafen, M.
Pub. info.: Proceedings of the Second International Symposium on Microstructures and Microfabricated Systems.  pp.297-308,  1995.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 95-27
4.

Conference Proceedings
Conference Proceedings
4. An electrically tunable infrared filter on base of Fabry-Perot interferometer
Kurth, S. ; Hiller, K. ; Neumann, N. ; Heinze, M. ; Doetzel, W. ; Gessner, T.
Pub. info.: Microwave and Optical Technology 2003.  pp.95-100,  2004.  Bellingham, Wash..  SPIE - The International Society of Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 5445
5.

Conference Proceedings
Conference Proceedings
5. Tunable Fabry-Perot interferometer for 3- to 4.5-μm wavelength with bulk micromachined reflector carrier
Kurth, S. ; Hiller, K. ; Neumann, N. ; Heinze, M. ; Doetzel, W. ; Gessner, T.
Pub. info.: MOEMS and Miniaturized Systems III.  pp.215-226,  2003.  Bellingham, Wash..  SPIE-The International Society for Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 4983
6.

Conference Proceedings
Conference Proceedings
6. Bonding and deep RIE: a powerful combination for high-aspect-ratio sensors and actuators
Hiller, K. ; Kuchler, M. ; Billep, D. ; Schroter, B. ; Dienel, M. ; Scheibner, D. ; Gessner, T.
Pub. info.: Micromachining and Microfabrication Process Technology X.  pp.80-91,  2005.  Bellingham, Wash..  SPIE - The International Society of Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 5715