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Development and Characterization of a Self-Cleaning Shallow Trench Etch Process for Robust 0.35 um and below Manufacturing Environments

Author(s):
Publication title:
Proceedings of the twelfth International Symposium on Plasma Processing
Title of ser.:
Electrochemical Society Proceedings Series
Ser. no.:
98-4
Pub. Year:
1998
Page(from):
210
Page(to):
221
Pub. info.:
Pennington, NJ: Electrochemical Society
ISSN:
01616374
ISBN:
9781566771986 [1566771986]
Language:
English
Call no.:
E23400/98-4
Type:
Conference Proceedings

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