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Highly integrated plastic package transceiver modules for large core fiber systems [6126-18]

Author(s):
Ho, F. ( Hong Kong Applied Science and Technology Research Institute Co. Ltd. (Hong Kong China) )
Hung, W. ( Hong Kong Applied Science and Technology Research Institute Co. Ltd. (Hong Kong China) )
Cheng, S. ( Hong Kong Applied Science and Technology Research Institute Co. Ltd. (Hong Kong China) )
Fu, K. ( Hong Kong Applied Science and Technology Research Institute Co. Ltd. (Hong Kong China) )
Wong, E. ( Hong Kong Applied Science and Technology Research Institute Co. Ltd. (Hong Kong China) )
Yau, K. ( Hong Kong Applied Science and Technology Research Institute Co. Ltd. (Hong Kong China) )
Choi, T. ( Hong Kong Applied Science and Technology Research Institute Co. Ltd. (Hong Kong China) )
Egnisaban, G. ( Hong Kong Applied Science and Technology Research Institute Co. Ltd. (Hong Kong China) )
Mangente, T. ( Hong Kong Applied Science and Technology Research Institute Co. Ltd. (Hong Kong China) )
Wipiejewski, T. ( Hong Kong Applied Science and Technology Research Institute Co. Ltd. (Hong Kong China) )
5 more
Publication title:
Photonics Packaging and Integration VI
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:
6126
Pub. Year:
2006
Page(from):
61260G
Pub. info.:
Bellingham, Wash.: SPIE - The International Society of Optical Engineering
ISSN:
0277786X
ISBN:
9780819461681 [0819461687]
Language:
English
Call no.:
P63600/6126
Type:
Conference Proceedings

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