Highly integrated plastic package transceiver modules for large core fiber systems [6126-18]
- Author(s):
Ho, F. ( Hong Kong Applied Science and Technology Research Institute Co. Ltd. (Hong Kong China) ) Hung, W. ( Hong Kong Applied Science and Technology Research Institute Co. Ltd. (Hong Kong China) ) Cheng, S. ( Hong Kong Applied Science and Technology Research Institute Co. Ltd. (Hong Kong China) ) Fu, K. ( Hong Kong Applied Science and Technology Research Institute Co. Ltd. (Hong Kong China) ) Wong, E. ( Hong Kong Applied Science and Technology Research Institute Co. Ltd. (Hong Kong China) ) Yau, K. ( Hong Kong Applied Science and Technology Research Institute Co. Ltd. (Hong Kong China) ) Choi, T. ( Hong Kong Applied Science and Technology Research Institute Co. Ltd. (Hong Kong China) ) Egnisaban, G. ( Hong Kong Applied Science and Technology Research Institute Co. Ltd. (Hong Kong China) ) Mangente, T. ( Hong Kong Applied Science and Technology Research Institute Co. Ltd. (Hong Kong China) ) Wipiejewski, T. ( Hong Kong Applied Science and Technology Research Institute Co. Ltd. (Hong Kong China) ) - Publication title:
- Photonics Packaging and Integration VI
- Title of ser.:
- Proceedings of SPIE - the International Society for Optical Engineering
- Ser. no.:
- 6126
- Pub. Year:
- 2006
- Page(from):
- 61260G
- Pub. info.:
- Bellingham, Wash.: SPIE - The International Society of Optical Engineering
- ISSN:
- 0277786X
- ISBN:
- 9780819461681 [0819461687]
- Language:
- English
- Call no.:
- P63600/6126
- Type:
- Conference Proceedings
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