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Conference Proceedings

1. Applications of Wafer Bonding to Non-Electronic Microstructures

Desmond, C.A. ; Abolghasem, P.

Pub. info.:	Proceedings of the Fourth International Symposium on Semiconductor Wafer Bonding : science, technology, and applications. pp.95-105, 1997. Pennington, NJ. Electrochemical Society
Title of ser.:	Electrochemical Society Proceedings Series
Ser. no.:	97-36

Conference Proceedings

2. Analysis of Nitride Bonding

Desmond, C.A. ; Olup, J.J. ; Abolghasem, P. ; Folta, J. ; Jernigan, G.

Pub. info.:	Proceedings of the Fourth International Symposium on Semiconductor Wafer Bonding : science, technology, and applications. pp.171-178, 1997. Pennington, NJ. Electrochemical Society
Title of ser.:	Electrochemical Society Proceedings Series
Ser. no.:	97-36