Two-Step Planarization of ECMP and CMP for MEMS Copper Patterns
- Author(s):
- Publication title:
- Eco-materials processing and design IX : selected, peer reviewed papers from 9th International Symposium on Eco-Materials Processing and Design, Changwon Convention Centre, Changwon City, Korea, January 07-09, 2008
- Title of ser.:
- Materials science forum
- Ser. no.:
- 569
- Pub. Year:
- 2008
- Page(from):
- 117
- Page(to):
- 120
- Pages:
- 4
- Pub. info.:
- Aedermannsdorf, Switzerland: Trans Tech Publications
- ISSN:
- 02555476
- Language:
- English
- Call no.:
- M23650
- Type:
- Conference Proceedings
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