1.

Conference Proceedings

Conference Proceedings
Letertre, F. ; Deguet, C. ; Richtarch, C. ; Faure, B. ; Hartmann, J.M. ; Chieu, F. ; Beaumont, A. ; Dechamp, J. ; Morales, C. ; Allibert, F. ; Perreau, P. ; Pocas, S. ; Personnic, S. ; Lagahe-Blanchard, C. ; Ghyselen, B. ; Vaillant, Y.M.Le ; Jalaguier, E. ; Kernevez, N. ; Mazure, C.
Pub. info.: High-mobility group-IV materials and devices : symposium held April 13-15, 2004, San Francisco, California, U.S.A..  pp.153-160,  2004.  Warrendale, Pa..  Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 809
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Conference Proceedings

Conference Proceedings
Deguet, C. ; Dechamp, J. ; Morales, C. ; Charvet, A.M. ; Clavelier, L. ; Loup V. ; Hartmann, J.M. ; Kernevez, N. ; Campidelli, Y. ; Allibert, F. ; Richtarche, C. ; Akatsu, T. ; Letertre, F.
Pub. info.: Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia.  pp.78-88,  2005.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2005-02