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The Effects of Copper on the Interfacial Failure of Gold Films

Author(s):
Publication title:
Thin films : stresses and mechanical properties IX : symposium held November 26-30, 2001, Boston, Massachusetts, U.S.A.
Title of ser.:
Materials Research Society symposium proceedings
Ser. no.:
695
Pub. Year:
2002
Page(from):
323
Page(to):
328
Pages:
6
Pub. info.:
Warrendale, Pa.: Materials Research Society
ISSN:
02729172
ISBN:
9781558996311 [1558996311]
Language:
English
Call no.:
M23500/695
Type:
Conference Proceedings

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