1.

Conference Proceedings
Conference Proceedings
1. Contact potential difference methods for full wafer characterization of Si/Si02 interface defects induced by plasma processing (Invited Paper)
Edelman,P. ; Savchouk,A. ; Wilson,M. ; Jastrzebski,L. ; Lagowski,J.J. ; Nauka,K. ; Ma,S. ; Hoff,A.M. ; DeBusk,D.K.
Pub. info.: In-Line Characterization Techniques for Performance and Yield Enhancement in Microelectronic Manufacturing II :23-24 September 1998 Santa Clara, California.  pp.126-136,  1998.  Bellingham, Wash..  SPIE-The International Society for Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 3509
2.

Conference Proceedings
Conference Proceedings
2. Small signal ac-surface photovoltage technique for noncontact monitoring of near-surface doping for IC-processing
Marinskiy,D.N. ; Lagowski,J.J. ; Wilson,M. ; Jastrzebski,L. ; Santiesteban,R. ; Elshot,K.
Pub. info.: Process Control and Diagnostics.  pp.72-77,  2000.  Bellingham, Wash..  SPIE-The International Society for Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 4182
3.

Conference Proceedings
Conference Proceedings
3. Effect of Fe and Cu contamination on the reliability of ultrathin gate oxides
D'Amico,J. ; Jastrzebski,L. ; Wilson,M. ; Savtchouk,A.
Pub. info.: In-Line Methods and Monitors for Process and Yield Improvement.  pp.124-135,  1999.  Bellingham, Wash..  SPIE - The International Society for Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 3884