1.

Conference Proceedings
Conference Proceedings
1. NEW APPROACH FOR STUDY OF PARTICLE ADHESION AND REMOVAL RELEVANT TO POST CMP CLEANING
Lee, S.-Y. ; Lee, S.-H. ; Eom, D.-H. ; Kim, K.-S. ; Song, H.-S. ; Park, J.-G.
Pub. info.: Cleaning technology semiconductor device manufacturing : proceedings of the seventh international symposium.  pp.180-186,  2001.  Pennington, N.J..  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2001-26
2.

Conference Proceedings
Conference Proceedings
2. EFFECT OF H2O2 AND IPA ADDITION IN DILUTE HF SOLUTION ON SURFACE ETCHING AND PARTICLE REMOVAL EFFICIENCY
Eom, D.-H. ; Lee, S.-H. ; Kim, K.-S. ; Lee, C.-H. ; Park, J.-G.
Pub. info.: Cleaning technology semiconductor device manufacturing : proceedings of the seventh international symposium.  pp.156-163,  2001.  Pennington, N.J..  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2001-26
3.

Conference Proceedings
Conference Proceedings
3. Passivation and Etching Behaviors of Copper Surface in Copper CMP Slurries
Eom, D.-H. ; Hong, Y.-K. ; Lee, S.-H. ; Park, J.-Y. ; Myung, J.-J. ; Park, J.-G. ; Kim, K.-S. ; Song, H.-S. ; Park, H.-S. ; Choi, Y.-S.
Pub. info.: Chemical Mechanical Planarization : proceedings of the International Symposium.  pp.226-236,  2002.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2002-1