1.

Conference Proceedings
Conference Proceedings
1. "Si-based multilayered print circuit board for MEMS packaging fabricated by Si deep etching, bonding, and metal powder injection"
Murakoshi,Y. ; Shimizu,T. ; Takagi,H. ; Li,Y. ; Uchino,K. ; Yokoi,T. ; Maeda,R.
Pub. info.: Design, test, integration, and packaging of MEMS/MOEMS 2001 : 25-27 April 2001, Cannes, France.  pp.502-509,  2001.  Bellingham, Washington.  SPIE-The International Society for Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 4408
2.

Technical Paper
Technical Paper
2. Formability of TS590 N/mm2 "Tri-Phase" Hot Rolled Steel
Shirasawa,H. ; Mimura,K. ; Yokoi,T. ; Shibata,Z. ; Inoue,N.
Pub. info.: Sheet Metal and Stamping Symposium.  pp.87-92,  1993.  Society of Automotive Engineering, Inc.
Title of ser.: SAE special publication
Ser. no.: SP-944