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Conference Proceedings

1. High Performance CMOS on SOI

Yang, I.Y. ; Fung, S. ; Sleight, J. ; Narasimha, S. ; Zamdmer, N. ; Smeys, P. ; Welser, J. ; Agnello, P. ; Leobandung, E. ; Shahidi, G.

Pub. info.:	Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia. pp.177-196, 2001. Pennington, NJ. Electrochemical Society
Title of ser.:	Electrochemical Society Proceedings Series
Ser. no.:	2001-27

Conference Proceedings

2. Ultrasonic Application to Scan the Layup of CFRP Composite Laminates

Yang, I.Y. ; Im, K.H. ; Hsu, D.K. ; Kim, S.K. ; Cho, Y.T.

Pub. info.:	Explosion, shock wave and hypervelocity phenomena in materials : proceedings of the 1st International Symposium on Explosion, Shock Wave and Hypervelocity Phenomena in Materials(ESHP Symposium), 15-17 March 2004, Kumamoto, Japan. pp.241-246, 2004. Zuerich. Trans Tech Publications
Title of ser.:	Materials science forum
Ser. no.:	465-466

Conference Proceedings

3. Characterization of Impact Damages and Responses in CFRP Composite Shells

Kim, Y.N. ; Im, K.H. ; Yang, I.Y.

Pub. info.:	Explosion, shock wave and hypervelocity phenomena in materials : proceedings of the 1st International Symposium on Explosion, Shock Wave and Hypervelocity Phenomena in Materials(ESHP Symposium), 15-17 March 2004, Kumamoto, Japan. pp.247-252, 2004. Zuerich. Trans Tech Publications
Title of ser.:	Materials science forum
Ser. no.:	465-466

Conference Proceedings

4. On Impact Characteristic Evaluation in CF/Epoxy Composites under Falling-Weight Impact Loadings

Yang, I.Y. ; Im, K.H. ; Park, J.W.

Pub. info.:	Designing, processing and properties of advanced engineering materials : proceedings of the 3rd International Symposium on Designing, Processing and Properties of Advanced Engineering Materials, held in Jeju, Korea, November 5-8, 2003. pp.749-752, 2004. Zuerich. Trans Tech Publications
Title of ser.:	Materials science forum
Ser. no.:	449-452