1.

Conference Proceedings
Conference Proceedings
1. Enhanced Adhesion of Cu Film on a Low-k Material by Using Ti Glue Layer, B Dopant and NU2 Plasma Treatment
Ko, Y. K. ; Lee, S. ; Yang, H. J. ; Shim, C. ; Jung, D. ; Lee, J. G.
Pub. info.: Materials, Technology and Reliability for Advanced Interconnects and Low-k Dielectrics-2003 : symposium held April 21-25, 2003, San Francisco, California, U.S.A..  pp.497-502,  2003.  Warrendale, Pa..  Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 766
2.

Conference Proceedings
Conference Proceedings
2. The improvement of DOF for sub-1OOnm process by focus scan [6154-56]
Kim, J. C. ; Yang, H. J. ; Jeon J.-H ; Park C.-H ; Moon, J ; Yim D ; Kim J. W ; Tseng S ; Rhe K.-K ; Min Y.-H ; Chen A C
Pub. info.: Optical Microlithography XIX.  pp.61541K-,  2006.  Bellingham, Wash..  SPIE - The International Society of Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 6154