1.

Conference Proceedings
Conference Proceedings
1. State of the Art Deep Silicon Anisotropic Etching on SOI Bonded Substrates for Dielectric Isolation and MEMS Applications
Gormley, C. ; Yallup, K. ; Nevin, W.A. ; Bhardwaj, J. ; Ashraf, H. ; Huggett, P. ; Blackstone, S.
Pub. info.: Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia.  pp.350-361,  1999.  Pennington, N.J..  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 99-35
2.

Conference Proceedings
Conference Proceedings
2. Complementary Bipolar Fabricated by the Bonding of Patterned Buried Layers
Irissou, P. ; Pilloud, V. ; Yallup, K. ; Brown, A. ; Gaston, G. ; Blackstone, S.
Pub. info.: Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia.  pp.438-442,  1999.  Pennington, N.J..  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 99-35
3.

Conference Proceedings
Conference Proceedings
3. Form C Opto-Solid State Relay on Bonded Wafer with 1600V Isolation
Sinclair, P. ; Whitney, D. ; Taggart, W. ; Yallup, K. ; Blackstone, S.
Pub. info.: Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia.  pp.402-406,  1999.  Pennington, N.J..  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 99-35
4.

Conference Proceedings
Conference Proceedings
4. Oxidation Induced Crystalline Defects in Bonded SOI Wafers
Papakonstantinou, P. ; Somasundram, K. ; Cao, X. ; Quinn, C. ; Yallup, K. ; Nevin, W.A. ; Blackstone, S.
Pub. info.: Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia.  pp.178-186,  1999.  Pennington, N.J..  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 99-35
5.

Conference Proceedings
Conference Proceedings
5. HVEM AND ELECTRICAL CHARACTERISATION OF SIMOX STRUCTURES
DeVeirman, A. ; Yallup, K. ; Van Landuyt, J. ; Maes, H. E. ; de Meyer, K. ; Dupas, L.
Pub. info.: Silicon-on-insulator and buried metals in semiconductors : symposium held November 30-December 3, 1987, Boston, Massachusetts, U.S.A..  pp.129-132,  1988.  Pittsburgh, Pa..  Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 107
6.

Conference Proceedings
Conference Proceedings
6. Bonded and Trenched SOI with Buried Silicide Layers
McDonnell, B. ; Blackstone, S. ; Wilson, R. ; Quinn, C. ; Yallup, K.
Pub. info.: Proceedings of the Third International Symposium on Semiconductor Wafer Bonding : physics and applications.  pp.535-545,  1995.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 95-7