1.

Conference Proceedings
Conference Proceedings
1. 3-D High-Density Strain Mapping Procedure Based on High-Resolution CT
M. Kobayashi ; H. Toda ; T. Ohgaki ; K. Uesugi ; D.S. Wilkinson ; T. Kobayashi ; Y. Kawai ; Y. Aoki
Pub. info.: THERMEC 2006 : supplement to THERMEC 2006, 5th International conference on processing and manufacturing of advanced materials, July 4-8, 2006, Vancouver, Canada.  539-543  pp.2377-2382,  2007.  Stafa-Zuerich.  Trans Tech Publications
Title of ser.: Materials science forum
Ser. no.: 539-543(3)
2.

Conference Proceedings
Conference Proceedings
2. STRUCTURE OF THE INTERFACE OF A BONDED WAFER
Y. Kawai ; S. Ishigami ; H. Furuya ; T. Shmgyouji ; Y. Saitoh
Pub. info.: Proceedings of the Second International Symposium on Semiconductor Wafer Bonding--Science, Technology, and Applications.  pp.216-224,  1993.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 1993-29
3.

Conference Proceedings
Conference Proceedings
3. Characterization of Surface Defects of Highly N-Doped 4H-SiC Substrates that Produce Dislocations in the Epitaxial Layer
Y. Ishikawa ; Y. Sugawara ; H. Saitoh ; K. Danno ; Y. Kawai
Pub. info.: Silicon carbide and related materials 2009 : selected peer reviewed papers from the International Conference on Silicon Carbide and Related Materials 2009, Nurnberg, Germany, October 11-16, 2009.  pp.351-354,  2010.  Aedermannsdorf, Switzerland.  Trans Tech Publications
Title of ser.: Materials science forum
Ser. no.: 645-648
4.

Conference Proceedings
Conference Proceedings
4. Metal-To-Silicon Contact Formation for Highly Reliable ULSI by Low-Energy Ion Bombardment Process
K. Yamada ; H. Yamada ; N. Konishi ; Y. Kawai ; T. Ohmi
Pub. info.: Proceedings of the Symposia on Interconnects, Contact Metallization, and Multilevel Metallization and Reliability for Semiconductor Devices, Interconnects, amd Thin Insulator Materials.  pp.256-267,  1993.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 1993-25
5.

Conference Proceedings
Conference Proceedings
5. New spatial frequency doubling method for sub-0.15-µm optical lithography
A. Otaka ; Y. Kawai ; A. Tanaka ; T. Matsuda
Pub. info.: Optical/laser microlithography VIII : 22-24 February, 1995, Santa Clara, California.  pp.816-826,  1995.  Bellingham, WA.  Society of Photo-optical Instrumentation Engineers
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 2440
6.

Conference Proceedings
Conference Proceedings
6. 3D image analysis for evaluating internal deformation/fracture characteristics of materials
M. Nakazawa ; Y. Aoki ; H. Toda ; M. Kobayashi ; Y. Kawai
Pub. info.: Optomechatronic computer-vision systems II : 8-10 October 2007, Lausanne, Switzerland.  pp.67180C-1-67180C-8,  2007.  Bellingham, Wash..  Society of Photo-optical Instrumentation Engineers
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 6718
7.

Conference Proceedings
Conference Proceedings
7. Thick InGaN growth on several crystal planes of ZnO substrate by metalorganic vapor phase epitaxy
Y. Kawai ; S. Ohsuka ; M. Iwaya ; S. Kamiyama ; H. Amano
Pub. info.: Physics and simulation of optoelectronic devices XVI : 21-24 January 2008, San Jose, California, USA.  pp.688904-1-688904-9,  2008.  Bellingham, Wash..  Society of Photo-optical Instrumentation Engineers
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 6889