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45nm design rule in-die overlay metrology on immersion lithography processes

Author(s):
Y. Shih ( United Microelectronics Corp. (Taiwan) )
G. K. Huang ( United Microelectronics Corp. (Taiwan) )
C. Yu ( United Microelectronics Corp. (Taiwan) )
M. Adel ( KLA-Tencor Israel (Israel) )
C. K. Huang ( KLA-Tencor Corp. (USA) )
P. Izikson ( KLA-Tencor Israel (Israel) )
E. Kassel ( KLA-Tencor Israel (Israel) )
S. Mathur ( KLA-Tencor Corp. (USA) )
C. Huang ( KLA-Tencor Corp. (USA) )
D. Tien ( KLA-Tencor Corp. (USA) )
Y. Avrahamov ( KLA-Tencor Israel (Israel) )
6 more
Publication title:
Metrology, inspection, and process control for microlithography XXI
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:
6518
Pub. Year:
2007
Pub. info.:
Bellingham, Wash.: SPIE - The International Society of Optical Engineering
ISSN:
0277786X
ISBN:
9780819466372 [0819466379]
Language:
English
Call no.:
P63600/6518
Type:
Conference Proceedings

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