1.

Conference Proceedings
Conference Proceedings
1. Beginning-to-end wafer bonding for advanced optical systems (Invited Paper)
Farrens, S.N. ; Lindner, P. ; Dwyer, S. ; Wimplinger, M.
Pub. info.: Gradient index, miniature, and diffractive optical systems III : 6-7 August 2003, San Diego, California, USA.  pp.31-36,  2003.  Bellingham, Wash., USA.  SPIE-The International Society for Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 5177
2.

Conference Proceedings
Conference Proceedings
2. Advanced Anodic Bonding Processes for MEMS Applications
Dragoi, V. ; Lindner, P. ; Glinsner, T. ; Wimplinger, M. ; Farrens, S.
Pub. info.: Micro- and nanosystems : symposium held December 1-3, 2003, Boston, Massachusetts, U.S.A..  pp.337-342,  2004.  Warrendale, Pa..  Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 782
3.

Conference Proceedings
Conference Proceedings
3. Plasma Bonding Replacement Methods for Traditional Bond Technologies
Farrens, S. ; Dragoi, V. ; Pelzer, R. ; Wimplinger, M. ; Lindner, P.
Pub. info.: Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia.  pp.58-63,  2005.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2005-02
4.

Conference Proceedings
Conference Proceedings
4. Effects of Bonding Process Parameters on Wafer-to-Wafer Alignment Accuracy in Benzocyclobutene (BCB) Dielectric Wafer Bonding.
Niklaus, F. ; Kumar, R.J. ; McMahon, J.J. ; Yu, J. ; Matthias, T. ; Wimplinger, M. ; Lindner, P. ; Lu, J.-Q. ; Cale, T.S. ; Gutmann, R.J.
Pub. info.: Materials, technology and reliability of advanced interconnects - 2005 : symposium held March 28-April 1, 2005, San Francisco, California, U.S.A..  pp.393-398,  2005.  Warrendale, Pa..  Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 863
5.

Conference Proceedings
Conference Proceedings
5. Fundamental Limits for 3D Wafer-to-Wafer Alignment Accuracy
Wimplinger, M. ; Lu, J.-Q. ; Yu, J. ; Kwon, Y. ; Matthias, T. ; Cale, T.S. ; Gutmann, R.J.
Pub. info.: Materials, technology and reliability for advanced interconnects and low-k dielectrics - 2004 : symposium held April 13-15, 2004, San Francisco, California, U.S.A..  pp.309-314,  2004.  Warrendale.  Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 812
6.

Conference Proceedings
Conference Proceedings
6. Application of imprint technologies for creation of micro- and nanoscale pattern
Glinsner, T. ; Beutl, M. ; Dwyer, S. ; Lindner, P. ; Wimplinger, M. ; Kettner, P. ; Hanna, S. ; Leising, G.
Pub. info.: BioMEMS and nanotechnology : 10-12 December 2003, Perth, Australia.  pp.100-105,  2004.  Bellingham, Wash., USA.  SPIE - The International Society of Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 5275