1.

Conference Proceedings

Conference Proceedings
Jung, E. ; Wiemer, M. ; Grosser, V. ; Bock, K. ; Wolf, J.
Pub. info.: Design, test, integration, and packaging of MEMS/MOEMS 2002 : 6-8 May, 2002, Cannes, France.  pp.508-514,  2002.  Bellingham, Wash..  SPIE-The International Society for Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 4755
2.

Conference Proceedings

Conference Proceedings
Petzold, M. ; Katzer, D. ; Wiemer, M. ; Bagdahn, J.
Pub. info.: Design, test, integration, and packaging of MEMS/MOEMS 2002 : 6-8 May, 2002, Cannes, France.  pp.613-623,  2002.  Bellingham, Wash..  SPIE-The International Society for Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 4755
3.

Conference Proceedings

Conference Proceedings
Gessner, T. ; Wiemer, M. ; Hiller, K. ; Hafen, M.
Pub. info.: Proceedings of the Second International Symposium on Microstructures and Microfabricated Systems.  pp.297-308,  1995.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 95-27
4.

Conference Proceedings

Conference Proceedings
Bagdahn, J. ; Katzer, D. ; Petzold, M. ; Wiemer, M.
Pub. info.: Proceedings of the Fourth International Symposium on Semiconductor Wafer Bonding : science, technology, and applications.  pp.285-290,  1997.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 97-36
5.

Conference Proceedings

Conference Proceedings
Dekorsy, T. ; Hudert, F. ; Cerna, R. ; Schafer, H. ; Janke, C. ; Bartels, A. ; Kohler, K. ; Braun, S. ; Wiemer, M. ; Mantl, S.
Pub. info.: Nanophotonics for Communication: Materials, Devices, and Systems III.  pp.63930H-,  2006.  Bellingham, Wash..  SPIE - The International Society of Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 6393
6.

Conference Proceedings

Conference Proceedings
Bagdahn, J. ; Ploessl, A. ; Wiemer, M. ; Petzold, M.
Pub. info.: Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia.  pp.218-223,  1999.  Pennington, N.J..  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 99-35
7.

Conference Proceedings

Conference Proceedings
Knechtel, R. ; Heller, J. ; Wiemer, M. ; Fromel, J.
Pub. info.: Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia.  pp.321-328,  2003.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2003-19
8.

Conference Proceedings

Conference Proceedings
Wiemer, M. ; Fromel, J. ; Jia, C. ; Gessner, T.
Pub. info.: Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia.  pp.301-308,  2003.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2003-19
9.

Conference Proceedings

Conference Proceedings
Wiemer, M. ; Hiller, K. ; Hahn, R. ; Kaufmann, C. ; Gessner, T.
Pub. info.: Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia.  pp.368-380,  1999.  Pennington, N.J..  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 99-35
10.

Conference Proceedings

Conference Proceedings
Wiemer, M. ; Zimmermann, S. ; Zhao, Q.T. ; Trui, B. ; Kaufmann, C. ; Mantl, S. ; Dudek, V. ; Gessner, T.
Pub. info.: Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia.  pp.303-310,  2005.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2005-02