1.

Conference Proceedings
Conference Proceedings
1. Low-Temperature Silicon Wafer Bonding with Titanium
Yu, J. ; Wang, Y.M. ; Lu, J.-Q. ; Gutmann, R.J.
Pub. info.: Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia.  pp.311-318,  2005.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2005-02
2.

Technical Paper
Technical Paper
2. On-Line Fastener Finish Quality Monitoring by Electrochemical Impedance Spectroscopy.
Wang, Y.M. ; Snyder, D.D.
Pub. info.: 2002 SAE world congress : technical paper.  2002.  Warrendale, Penn..  Society of Automotive Engineers
Title of ser.: Society of Automotive Engineers technical paper series
Ser. no.: 2002
3.

Technical Paper
Technical Paper
3. INTEGRATED REFLECTOR ANTENNA DESIGN AND ANALYSIS
Zimmerman, M.L. ; Lee, S.W. ; Ni, S. ; Christensen, M. ; Wang, Y.M.
Pub. info.: NASA Technical Reports.  (NASA-CR-195164),  pp.1-188,  1993.  National Aeronautics and Space Adminstration