1.

Conference Proceedings
Conference Proceedings
1. Effect of Organic Amine in Colloidal Silica Slurry on Polishing-rate Selectivity of Copper to Tantalum-nitride Film in Copper Chemical Mechanical Planarization
J. Park ; H. Cui ; H. Hwang ; U. Paik ; H. Park
Pub. info.: Chemical Mechanical Polishing 9.  pp.51-57,  2008.  Pennington, N.J..  Electrochemical Society
Title of ser.: ECS transactions
Ser. no.: 13(4)
2.

Conference Proceedings
Conference Proceedings
2. Effect of Alkaline Agent with Organic Additive in Colloidal Silica Slurry on Polishing Rate Selectivity of Polysilicon-to-SiO2 in Polysilicon CMP
H. Hwang ; H. Kang ; J. Park ; U. Paik ; H. Park
Pub. info.: Chemical Mechanical Polishing 9.  pp.67-73,  2008.  Pennington, N.J..  Electrochemical Society
Title of ser.: ECS transactions
Ser. no.: 13(4)